Journal article 1850 views
Operational frequency degradation induced trapping in scaled GaN HEMTs
Microelectronics Reliability, Volume: 71, Pages: 35 - 40
Swansea University Author:
Karol Kalna
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1016/j.microrel.2017.02.008
Abstract
Cut-off frequency increase from 12.1 GHz to 26.4 GHz, 52.1 GHz and 91.4 GHz is observed when the 1 μm gate length GaN HEMT is laterally scaled down to LG = 0.5 μm, LG = 0.25 μm and LG = 0.125 μm, respectively. The study is based on accurately calibrated transfer characteristics (ID-VGS) of the 1 μm...
| Published in: | Microelectronics Reliability |
|---|---|
| ISSN: | 0026-2714 |
| Published: |
2017
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| Online Access: |
Check full text
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa32025 |
| first_indexed |
2017-02-21T20:02:21Z |
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| last_indexed |
2023-01-11T14:05:28Z |
| id |
cronfa32025 |
| recordtype |
SURis |
| fullrecord |
<?xml version="1.0"?><rfc1807><datestamp>2022-10-10T15:48:05.6504131</datestamp><bib-version>v2</bib-version><id>32025</id><entry>2017-02-21</entry><title>Operational frequency degradation induced trapping in scaled GaN HEMTs</title><swanseaauthors><author><sid>1329a42020e44fdd13de2f20d5143253</sid><ORCID>0000-0002-6333-9189</ORCID><firstname>Karol</firstname><surname>Kalna</surname><name>Karol Kalna</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2017-02-21</date><deptcode>ACEM</deptcode><abstract>Cut-off frequency increase from 12.1 GHz to 26.4 GHz, 52.1 GHz and 91.4 GHz is observed when the 1 μm gate length GaN HEMT is laterally scaled down to LG = 0.5 μm, LG = 0.25 μm and LG = 0.125 μm, respectively. The study is based on accurately calibrated transfer characteristics (ID-VGS) of the 1 μm gate length device using Silvaco TCAD. If the scaling is also performed horizontally, proportionally to the lateral (full scaling), the maximum drain current is reduced by 38.2% when the gate-to-channel separation scales from 33 nm to 8.25 nm. Degradation of the RF performance of a GaN HEMT due to the electric field induced acceptor traps experienced under a high electrical stress is found to be about 8% for 1 μm gate length device. The degradation of scaled HEMTs reduces to 3.5% and 7.3% for the 0.25 μm and 0.125 gate length devices, respectively. The traps at energy level of ET = EV + 0.9 eV (carbon) with concentrations of NIT = 5 × 1016cm− 3, NIT = 5 × 1017cm− 3 and NIT = 5 × 1018cm− 3 are located in the drain access region where highest electrical field is expected. The effect of traps on the cut-off frequency is reduced for devices with shorter gate lengths down to 0.125 μm.</abstract><type>Journal Article</type><journal>Microelectronics Reliability</journal><volume>71</volume><journalNumber/><paginationStart>35</paginationStart><paginationEnd>40</paginationEnd><publisher/><placeOfPublication/><isbnPrint/><isbnElectronic/><issnPrint>0026-2714</issnPrint><issnElectronic/><keywords>GaN HEMTs; Traps; Degradation; Radio frequency; Device modelling</keywords><publishedDay>31</publishedDay><publishedMonth>12</publishedMonth><publishedYear>2017</publishedYear><publishedDate>2017-12-31</publishedDate><doi>10.1016/j.microrel.2017.02.008</doi><url/><notes/><college>COLLEGE NANME</college><department>Aerospace, Civil, Electrical, and Mechanical Engineering</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>ACEM</DepartmentCode><institution>Swansea University</institution><apcterm/><funders/><projectreference/><lastEdited>2022-10-10T15:48:05.6504131</lastEdited><Created>2017-02-21T13:31:06.9577760</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering</level></path><authors><author><firstname>Brendan</firstname><surname>Ubochi</surname><order>1</order></author><author><firstname>Soroush</firstname><surname>Faramehr</surname><order>2</order></author><author><firstname>Khaled</firstname><surname>Ahmeda</surname><order>3</order></author><author><firstname>Petar</firstname><surname>Igić</surname><order>4</order></author><author><firstname>Karol</firstname><surname>Kalna</surname><orcid>0000-0002-6333-9189</orcid><order>5</order></author></authors><documents/><OutputDurs/></rfc1807> |
| spelling |
2022-10-10T15:48:05.6504131 v2 32025 2017-02-21 Operational frequency degradation induced trapping in scaled GaN HEMTs 1329a42020e44fdd13de2f20d5143253 0000-0002-6333-9189 Karol Kalna Karol Kalna true false 2017-02-21 ACEM Cut-off frequency increase from 12.1 GHz to 26.4 GHz, 52.1 GHz and 91.4 GHz is observed when the 1 μm gate length GaN HEMT is laterally scaled down to LG = 0.5 μm, LG = 0.25 μm and LG = 0.125 μm, respectively. The study is based on accurately calibrated transfer characteristics (ID-VGS) of the 1 μm gate length device using Silvaco TCAD. If the scaling is also performed horizontally, proportionally to the lateral (full scaling), the maximum drain current is reduced by 38.2% when the gate-to-channel separation scales from 33 nm to 8.25 nm. Degradation of the RF performance of a GaN HEMT due to the electric field induced acceptor traps experienced under a high electrical stress is found to be about 8% for 1 μm gate length device. The degradation of scaled HEMTs reduces to 3.5% and 7.3% for the 0.25 μm and 0.125 gate length devices, respectively. The traps at energy level of ET = EV + 0.9 eV (carbon) with concentrations of NIT = 5 × 1016cm− 3, NIT = 5 × 1017cm− 3 and NIT = 5 × 1018cm− 3 are located in the drain access region where highest electrical field is expected. The effect of traps on the cut-off frequency is reduced for devices with shorter gate lengths down to 0.125 μm. Journal Article Microelectronics Reliability 71 35 40 0026-2714 GaN HEMTs; Traps; Degradation; Radio frequency; Device modelling 31 12 2017 2017-12-31 10.1016/j.microrel.2017.02.008 COLLEGE NANME Aerospace, Civil, Electrical, and Mechanical Engineering COLLEGE CODE ACEM Swansea University 2022-10-10T15:48:05.6504131 2017-02-21T13:31:06.9577760 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering Brendan Ubochi 1 Soroush Faramehr 2 Khaled Ahmeda 3 Petar Igić 4 Karol Kalna 0000-0002-6333-9189 5 |
| title |
Operational frequency degradation induced trapping in scaled GaN HEMTs |
| spellingShingle |
Operational frequency degradation induced trapping in scaled GaN HEMTs Karol Kalna |
| title_short |
Operational frequency degradation induced trapping in scaled GaN HEMTs |
| title_full |
Operational frequency degradation induced trapping in scaled GaN HEMTs |
| title_fullStr |
Operational frequency degradation induced trapping in scaled GaN HEMTs |
| title_full_unstemmed |
Operational frequency degradation induced trapping in scaled GaN HEMTs |
| title_sort |
Operational frequency degradation induced trapping in scaled GaN HEMTs |
| author_id_str_mv |
1329a42020e44fdd13de2f20d5143253 |
| author_id_fullname_str_mv |
1329a42020e44fdd13de2f20d5143253_***_Karol Kalna |
| author |
Karol Kalna |
| author2 |
Brendan Ubochi Soroush Faramehr Khaled Ahmeda Petar Igić Karol Kalna |
| format |
Journal article |
| container_title |
Microelectronics Reliability |
| container_volume |
71 |
| container_start_page |
35 |
| publishDate |
2017 |
| institution |
Swansea University |
| issn |
0026-2714 |
| doi_str_mv |
10.1016/j.microrel.2017.02.008 |
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Faculty of Science and Engineering |
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|
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facultyofscienceandengineering |
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Faculty of Science and Engineering |
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facultyofscienceandengineering |
| hierarchy_parent_title |
Faculty of Science and Engineering |
| department_str |
School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering |
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0 |
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0 |
| description |
Cut-off frequency increase from 12.1 GHz to 26.4 GHz, 52.1 GHz and 91.4 GHz is observed when the 1 μm gate length GaN HEMT is laterally scaled down to LG = 0.5 μm, LG = 0.25 μm and LG = 0.125 μm, respectively. The study is based on accurately calibrated transfer characteristics (ID-VGS) of the 1 μm gate length device using Silvaco TCAD. If the scaling is also performed horizontally, proportionally to the lateral (full scaling), the maximum drain current is reduced by 38.2% when the gate-to-channel separation scales from 33 nm to 8.25 nm. Degradation of the RF performance of a GaN HEMT due to the electric field induced acceptor traps experienced under a high electrical stress is found to be about 8% for 1 μm gate length device. The degradation of scaled HEMTs reduces to 3.5% and 7.3% for the 0.25 μm and 0.125 gate length devices, respectively. The traps at energy level of ET = EV + 0.9 eV (carbon) with concentrations of NIT = 5 × 1016cm− 3, NIT = 5 × 1017cm− 3 and NIT = 5 × 1018cm− 3 are located in the drain access region where highest electrical field is expected. The effect of traps on the cut-off frequency is reduced for devices with shorter gate lengths down to 0.125 μm. |
| published_date |
2017-12-31T07:51:13Z |
| _version_ |
1851016268929302528 |
| score |
11.364513 |

