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Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates

Bahaa Abbas, Youmna Mohammad, Eifion Jewell Orcid Logo, Justin Searle Orcid Logo, Youmna Mouhamad

Journal of Materials Science: Materials in Electronics, Volume: 30, Issue: 22, Pages: 19917 - 19927

Swansea University Authors: Bahaa Abbas, Eifion Jewell Orcid Logo, Justin Searle Orcid Logo, Youmna Mouhamad

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DOI (Published version): 10.1007/s10854-019-02358-x

Abstract

Copper inks potentially provide a cost effective replacement to silver for printed electronic circuits. In glass based applications such as PV or smart glass, it can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper p...

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Published in: Journal of Materials Science: Materials in Electronics
ISSN: 0957-4522 1573-482X
Published: Springer Science and Business Media LLC 2019
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URI: https://cronfa.swan.ac.uk/Record/cronfa52517
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fullrecord <?xml version="1.0"?><rfc1807><datestamp>2019-10-19T21:21:46.6783225</datestamp><bib-version>v2</bib-version><id>52517</id><entry>2019-10-19</entry><title>Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates</title><swanseaauthors><author><sid>70f72a44d3b1b045e0473147441a80d2</sid><firstname>Bahaa</firstname><surname>Abbas</surname><name>Bahaa Abbas</name><active>true</active><ethesisStudent>false</ethesisStudent></author><author><sid>13dc152c178d51abfe0634445b0acf07</sid><ORCID>0000-0002-6894-2251</ORCID><firstname>Eifion</firstname><surname>Jewell</surname><name>Eifion Jewell</name><active>true</active><ethesisStudent>false</ethesisStudent></author><author><sid>0e3f2c3812f181eaed11c45554d4cdd0</sid><ORCID>0000-0003-1101-075X</ORCID><firstname>Justin</firstname><surname>Searle</surname><name>Justin Searle</name><active>true</active><ethesisStudent>false</ethesisStudent></author><author><sid>24a6a0a4d08557112dfcfbcdb07d7013</sid><ORCID/><firstname>Youmna</firstname><surname>Mouhamad</surname><name>Youmna Mouhamad</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2019-10-19</date><deptcode>MTLS</deptcode><abstract>Copper inks potentially provide a cost effective replacement to silver for printed electronic circuits. In glass based applications such as PV or smart glass, it can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine the relationship between sintering temperature, sintering time and gaseous environment on the electrical qualities of the sintered printed films deposited on FTO coated glass. There is a definite interaction between the particulate nature of the ink, the sintering conditions and the conductive properties of the film. Films containing only nano-particles provide the most conductive films with optimum sintering conditions of temperatures of 225 &#xB0;C for 60 min. The inclusion of micro particles increased the ideal sintering temperature but lowered the sintering time. An ink containing an equal mixture of nano and micro particles exhibited the lowest performance and this could be attributed to partial oxidation of the nano-particles along the conductive path, which occurs as a result of the presence of the micro particles.</abstract><type>Journal Article</type><journal>Journal of Materials Science: Materials in Electronics</journal><volume>30</volume><journalNumber>22</journalNumber><paginationStart>19917</paginationStart><paginationEnd>19927</paginationEnd><publisher>Springer Science and Business Media LLC</publisher><issnPrint>0957-4522</issnPrint><issnElectronic>1573-482X</issnElectronic><keywords>Thermal sintering; nano copper; conductive ink</keywords><publishedDay>1</publishedDay><publishedMonth>11</publishedMonth><publishedYear>2019</publishedYear><publishedDate>2019-11-01</publishedDate><doi>10.1007/s10854-019-02358-x</doi><url>http://dx.doi.org/10.1007/s10854-019-02358-x</url><notes>This publication is unique in identifying optimum thermal processing conditions for screen printed copper conductive inks on substrates used for next generation photovoltaic technology. The work clearly demonstrates that copper conductive circuits are robust and compatible with current processing technologies. This provides evidence that low cost copper is a viable alternative for costly silver materials, reducing the bill of materials for large area energy harvesting.</notes><college>COLLEGE NANME</college><department>Materials Science and Engineering</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>MTLS</DepartmentCode><institution>Swansea University</institution><apcterm/><lastEdited>2019-10-19T21:21:46.6783225</lastEdited><Created>2019-10-19T21:20:04.0779046</Created><authors><author><firstname>Bahaa</firstname><surname>Abbas</surname><order>1</order></author><author><firstname>Youmna</firstname><surname>Mohammad</surname><order>2</order></author><author><firstname>Eifion</firstname><surname>Jewell</surname><orcid>0000-0002-6894-2251</orcid><order>3</order></author><author><firstname>Justin</firstname><surname>Searle</surname><orcid>0000-0003-1101-075X</orcid><order>4</order></author><author><firstname>Youmna</firstname><surname>Mouhamad</surname><orcid/><order>5</order></author></authors><documents><document><filename>52517__15858__60f843c314f8425289ab57f202558d88.pdf</filename><originalFilename>V2 Abbas et al copper thermal sintering.pdf</originalFilename><uploaded>2019-11-12T09:09:33.9974871</uploaded><type>Output</type><contentLength>1127972</contentLength><contentType>application/pdf</contentType><version>Accepted Manuscript</version><cronfaStatus>true</cronfaStatus><embargoDate>2020-10-19T00:00:00.0000000</embargoDate><copyrightCorrect>true</copyrightCorrect></document></documents><OutputDurs/></rfc1807>
spelling 2019-10-19T21:21:46.6783225 v2 52517 2019-10-19 Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates 70f72a44d3b1b045e0473147441a80d2 Bahaa Abbas Bahaa Abbas true false 13dc152c178d51abfe0634445b0acf07 0000-0002-6894-2251 Eifion Jewell Eifion Jewell true false 0e3f2c3812f181eaed11c45554d4cdd0 0000-0003-1101-075X Justin Searle Justin Searle true false 24a6a0a4d08557112dfcfbcdb07d7013 Youmna Mouhamad Youmna Mouhamad true false 2019-10-19 MTLS Copper inks potentially provide a cost effective replacement to silver for printed electronic circuits. In glass based applications such as PV or smart glass, it can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine the relationship between sintering temperature, sintering time and gaseous environment on the electrical qualities of the sintered printed films deposited on FTO coated glass. There is a definite interaction between the particulate nature of the ink, the sintering conditions and the conductive properties of the film. Films containing only nano-particles provide the most conductive films with optimum sintering conditions of temperatures of 225 °C for 60 min. The inclusion of micro particles increased the ideal sintering temperature but lowered the sintering time. An ink containing an equal mixture of nano and micro particles exhibited the lowest performance and this could be attributed to partial oxidation of the nano-particles along the conductive path, which occurs as a result of the presence of the micro particles. Journal Article Journal of Materials Science: Materials in Electronics 30 22 19917 19927 Springer Science and Business Media LLC 0957-4522 1573-482X Thermal sintering; nano copper; conductive ink 1 11 2019 2019-11-01 10.1007/s10854-019-02358-x http://dx.doi.org/10.1007/s10854-019-02358-x This publication is unique in identifying optimum thermal processing conditions for screen printed copper conductive inks on substrates used for next generation photovoltaic technology. The work clearly demonstrates that copper conductive circuits are robust and compatible with current processing technologies. This provides evidence that low cost copper is a viable alternative for costly silver materials, reducing the bill of materials for large area energy harvesting. COLLEGE NANME Materials Science and Engineering COLLEGE CODE MTLS Swansea University 2019-10-19T21:21:46.6783225 2019-10-19T21:20:04.0779046 Bahaa Abbas 1 Youmna Mohammad 2 Eifion Jewell 0000-0002-6894-2251 3 Justin Searle 0000-0003-1101-075X 4 Youmna Mouhamad 5 52517__15858__60f843c314f8425289ab57f202558d88.pdf V2 Abbas et al copper thermal sintering.pdf 2019-11-12T09:09:33.9974871 Output 1127972 application/pdf Accepted Manuscript true 2020-10-19T00:00:00.0000000 true
title Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
spellingShingle Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
Bahaa Abbas
Eifion Jewell
Justin Searle
Youmna Mouhamad
title_short Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
title_full Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
title_fullStr Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
title_full_unstemmed Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
title_sort Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
author_id_str_mv 70f72a44d3b1b045e0473147441a80d2
13dc152c178d51abfe0634445b0acf07
0e3f2c3812f181eaed11c45554d4cdd0
24a6a0a4d08557112dfcfbcdb07d7013
author_id_fullname_str_mv 70f72a44d3b1b045e0473147441a80d2_***_Bahaa Abbas
13dc152c178d51abfe0634445b0acf07_***_Eifion Jewell
0e3f2c3812f181eaed11c45554d4cdd0_***_Justin Searle
24a6a0a4d08557112dfcfbcdb07d7013_***_Youmna Mouhamad
author Bahaa Abbas
Eifion Jewell
Justin Searle
Youmna Mouhamad
author2 Bahaa Abbas
Youmna Mohammad
Eifion Jewell
Justin Searle
Youmna Mouhamad
format Journal article
container_title Journal of Materials Science: Materials in Electronics
container_volume 30
container_issue 22
container_start_page 19917
publishDate 2019
institution Swansea University
issn 0957-4522
1573-482X
doi_str_mv 10.1007/s10854-019-02358-x
publisher Springer Science and Business Media LLC
url http://dx.doi.org/10.1007/s10854-019-02358-x
document_store_str 1
active_str 0
description Copper inks potentially provide a cost effective replacement to silver for printed electronic circuits. In glass based applications such as PV or smart glass, it can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine the relationship between sintering temperature, sintering time and gaseous environment on the electrical qualities of the sintered printed films deposited on FTO coated glass. There is a definite interaction between the particulate nature of the ink, the sintering conditions and the conductive properties of the film. Films containing only nano-particles provide the most conductive films with optimum sintering conditions of temperatures of 225 °C for 60 min. The inclusion of micro particles increased the ideal sintering temperature but lowered the sintering time. An ink containing an equal mixture of nano and micro particles exhibited the lowest performance and this could be attributed to partial oxidation of the nano-particles along the conductive path, which occurs as a result of the presence of the micro particles.
published_date 2019-11-01T04:04:56Z
_version_ 1763753377675608064
score 11.037603

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