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Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass
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Justin Searle
Journal of Electronic Materials, Volume: 53, Issue: 5, Pages: 2498 - 2503
Swansea University Authors:
Bahaa Abbas, Eifion Jewell , Justin Searle
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DOI (Published version): 10.1007/s11664-024-10962-9
Abstract
Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and s...
| Published in: | Journal of Electronic Materials |
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| ISSN: | 0361-5235 1543-186X |
| Published: |
Springer Science and Business Media LLC
2024
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| Online Access: |
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa66550 |
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| Abstract: |
Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and subsequently sintering in order to establish their resultant electrical and physical performance. Commercial materials were mixed, printed, and sintered at two thermal regimes on fluorine-doped tin oxide (FTO)-coated glass substrate. The inclusion of 25% silver provided an appreciable reduction in electrical resistance from 4.21 Ω to 0.93 Ω, with further silver additions having less impact. The thermal regime used for sintering had a secondary impact on the final electrical performance. The addition of silver reduced the adhesion to the FTO substrate, with reduced film integrity. The results show that blending inks offers the advantage of enhancing material conductivity while simultaneously reducing costs, making it a compelling area for exploration and advancement in the field of electronics manufacturing. |
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| Keywords: |
Nano silver; copper inks; conductive ink; sintering |
| College: |
Faculty of Science and Engineering |
| Funders: |
The Funding was provided by Engineering and Physical Sciences Research Council, EP/N020863/1, Bahaa Abbas |
| Issue: |
5 |
| Start Page: |
2498 |
| End Page: |
2503 |