Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass

Abbas, Bahaa; Jewell, Eifion; Searle, Justin

doi:10.1007/s11664-024-10962-9

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Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass

Bahaa Abbas, Eifion Jewell

, Justin Searle

Journal of Electronic Materials, Volume: 53, Issue: 5, Pages: 2498 - 2503

Swansea University Authors: Bahaa Abbas, Eifion Jewell , Justin Searle

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DOI (Published version): 10.1007/s11664-024-10962-9

Abstract

Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and s...

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Published in:	Journal of Electronic Materials
ISSN:	0361-5235 1543-186X
Published:	Springer Science and Business Media LLC 2024
Online Access:	Check full text
URI:	https://cronfa.swan.ac.uk/Record/cronfa66550
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first_indexed	2024-05-31T14:16:41Z
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spelling	v2 66550 2024-05-31 Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass 70f72a44d3b1b045e0473147441a80d2 Bahaa Abbas Bahaa Abbas true false 13dc152c178d51abfe0634445b0acf07 0000-0002-6894-2251 Eifion Jewell Eifion Jewell true false 0e3f2c3812f181eaed11c45554d4cdd0 0000-0003-1101-075X Justin Searle Justin Searle true false 2024-05-31 Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and subsequently sintering in order to establish their resultant electrical and physical performance. Commercial materials were mixed, printed, and sintered at two thermal regimes on fluorine-doped tin oxide (FTO)-coated glass substrate. The inclusion of 25% silver provided an appreciable reduction in electrical resistance from 4.21 Ω to 0.93 Ω, with further silver additions having less impact. The thermal regime used for sintering had a secondary impact on the final electrical performance. The addition of silver reduced the adhesion to the FTO substrate, with reduced film integrity. The results show that blending inks offers the advantage of enhancing material conductivity while simultaneously reducing costs, making it a compelling area for exploration and advancement in the field of electronics manufacturing. Journal Article Journal of Electronic Materials 53 5 2498 2503 Springer Science and Business Media LLC 0361-5235 1543-186X Nano silver; copper inks; conductive ink; sintering 1 5 2024 2024-05-01 10.1007/s11664-024-10962-9 COLLEGE NANME COLLEGE CODE Swansea University SU Library paid the OA fee (TA Institutional Deal) The Funding was provided by Engineering and Physical Sciences Research Council, EP/N020863/1, Bahaa Abbas 2024-05-31T15:19:06.7017407 2024-05-31T15:14:51.2168335 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering Bahaa Abbas 1 Eifion Jewell 0000-0002-6894-2251 2 Justin Searle 0000-0003-1101-075X 3 66550__30501__e385fad4424b4e7ab01d2d03500d592f.pdf 66550.VoR.pdf 2024-05-31T15:17:07.8611388 Output 1829012 application/pdf Version of Record true This article is licensed under a Creative Commons Attribution 4.0 International License. true eng http://creativecommons.org/licenses/by/4.0/
title	Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass
spellingShingle	Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass Bahaa Abbas Eifion Jewell Justin Searle
title_short	Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass
title_full	Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass
title_fullStr	Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass
title_full_unstemmed	Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass
title_sort	Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass
author_id_str_mv	70f72a44d3b1b045e0473147441a80d2 13dc152c178d51abfe0634445b0acf07 0e3f2c3812f181eaed11c45554d4cdd0
author_id_fullname_str_mv	70f72a44d3b1b045e0473147441a80d2_*_Bahaa Abbas 13dc152c178d51abfe0634445b0acf07__Eifion Jewell 0e3f2c3812f181eaed11c45554d4cdd0_**_Justin Searle
author	Bahaa Abbas Eifion Jewell Justin Searle
author2	Bahaa Abbas Eifion Jewell Justin Searle
format	Journal article
container_title	Journal of Electronic Materials
container_volume	53
container_issue	5
container_start_page	2498
publishDate	2024
institution	Swansea University
issn	0361-5235 1543-186X
doi_str_mv	10.1007/s11664-024-10962-9
publisher	Springer Science and Business Media LLC
college_str	Faculty of Science and Engineering
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hierarchy_top_title	Faculty of Science and Engineering
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department_str	School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering
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description	Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and subsequently sintering in order to establish their resultant electrical and physical performance. Commercial materials were mixed, printed, and sintered at two thermal regimes on fluorine-doped tin oxide (FTO)-coated glass substrate. The inclusion of 25% silver provided an appreciable reduction in electrical resistance from 4.21 Ω to 0.93 Ω, with further silver additions having less impact. The thermal regime used for sintering had a secondary impact on the final electrical performance. The addition of silver reduced the adhesion to the FTO substrate, with reduced film integrity. The results show that blending inks offers the advantage of enhancing material conductivity while simultaneously reducing costs, making it a compelling area for exploration and advancement in the field of electronics manufacturing.
published_date	2024-05-01T15:19:05Z
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score	11.037603

Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass

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