Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates - Bahaa Abbas (Journal of Materials Science: Materials in Electronics, 2019)
This publication is unique in identifying optimum thermal processing conditions for screen printed copper conductive inks on substrates used for next generation photovoltaic technology. The work clearly demonstrates that copper conductive circuits are robust and compatible with current processing technologies. This provides evidence that low cost copper is a viable alternative for costly silver materials, reducing the bill of materials for large area energy harvesting.