Abbas, B., Mohammad, Y., Jewell, E., Searle, J., & Mouhamad, Y. (2019). Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates. Journal of Materials Science: Materials in Electronics, 30(22), pp. 19917-19927. doi:10.1007/s10854-019-02358-x
Chicago Style CitationAbbas, Bahaa, Youmna Mohammad, Eifion Jewell, Justin Searle, and Youmna Mouhamad. "Thermal Sintering of Printable Copper for Enhanced Conductivity of FTO Coated Glass Substrates." Journal of Materials Science: Materials in Electronics 30, no. 22 (2019): 19917-19927.
MLA CitationAbbas, Bahaa, et al. "Thermal Sintering of Printable Copper for Enhanced Conductivity of FTO Coated Glass Substrates." Journal of Materials Science: Materials in Electronics 30.22 (2019): 19917-19927.