Journal article 1641 views
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys
J. Eckermann,
S. Mehmood,
H.M. Davies,
N.P. Lavery,
S.G.R. Brown,
J. Sienz,
A. Jones,
P. Sommerfeld,
Steve Brown,
Johann Sienz 
,
Nicholas Lavery ,
Helen Davies
,
Nicholas Lavery ,
Helen Davies
Microelectronics Reliability, Volume: 54, Issue: 6-7, Pages: 1235 - 1242
Swansea University Authors:
Steve Brown, Johann Sienz , Nicholas Lavery , Helen Davies
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1016/j.microrel.2014.02.017
Abstract
The primary aim of this investigation was to understand the effect of temperature fluctuations on a number of various solder materials namely SAC105, SAC305, SAC405 and Sn–36Pb–2Ag. To achieve this objective, three different classic joint assemblies (a ball joint, a test specimen joint and finger le...
| Published in: | Microelectronics Reliability |
|---|---|
| ISSN: | 0026-2714 |
| Published: |
2014
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa22172 |
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<?xml version="1.0"?><rfc1807><datestamp>2019-03-29T18:18:53.0450769</datestamp><bib-version>v2</bib-version><id>22172</id><entry>2015-06-25</entry><title>Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys</title><swanseaauthors><author><sid>07a865adc76376646bc6c03a69ce35a9</sid><firstname>Steve</firstname><surname>Brown</surname><name>Steve Brown</name><active>true</active><ethesisStudent>false</ethesisStudent></author><author><sid>17bf1dd287bff2cb01b53d98ceb28a31</sid><ORCID>0000-0003-3136-5718</ORCID><firstname>Johann</firstname><surname>Sienz</surname><name>Johann Sienz</name><active>true</active><ethesisStudent>false</ethesisStudent></author><author><sid>9f102ff59824fd4f7ce3d40144304395</sid><ORCID>0000-0003-0953-5936</ORCID><firstname>Nicholas</firstname><surname>Lavery</surname><name>Nicholas Lavery</name><active>true</active><ethesisStudent>false</ethesisStudent></author><author><sid>a5277aa17f0f10a481da9e9751ccaeef</sid><ORCID>0000-0003-4838-9572</ORCID><firstname>Helen</firstname><surname>Davies</surname><name>Helen Davies</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2015-06-25</date><deptcode>FGSEN</deptcode><abstract>The primary aim of this investigation was to understand the effect of temperature fluctuations on a number of various solder materials namely SAC105, SAC305, SAC405 and Sn–36Pb–2Ag. To achieve this objective, three different classic joint assemblies (a ball joint, a test specimen joint and finger lead joint) were modeled which provided the foundation for the creep and fatigue behaviors simulation. Anand’s viscoplasticity as a constitutive equation was employed to characterize the behavior of solders numerically under the influence of thermal power cycles (80–150 °C) and thermal shock cycles (−40 to 125 °C). To extend the research outcome for industrial use, two additional research activities were carried out. One of them was to obtain lifetime-predictions of solder joints based on Coffin Manson concept. The other one focused on parameterization to obtain the ideal solder thickness under the consideration of plastic strain and economic benefit.</abstract><type>Journal Article</type><journal>Microelectronics Reliability</journal><volume>54</volume><journalNumber>6-7</journalNumber><paginationStart>1235</paginationStart><paginationEnd>1242</paginationEnd><publisher/><issnPrint>0026-2714</issnPrint><keywords/><publishedDay>30</publishedDay><publishedMonth>6</publishedMonth><publishedYear>2014</publishedYear><publishedDate>2014-06-30</publishedDate><doi>10.1016/j.microrel.2014.02.017</doi><url/><notes/><college>COLLEGE NANME</college><department>Science and Engineering - Faculty</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>FGSEN</DepartmentCode><institution>Swansea University</institution><apcterm/><lastEdited>2019-03-29T18:18:53.0450769</lastEdited><Created>2015-06-25T19:00:55.9174837</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Engineering and Applied Sciences - Uncategorised</level></path><authors><author><firstname>J.</firstname><surname>Eckermann</surname><order>1</order></author><author><firstname>S.</firstname><surname>Mehmood</surname><order>2</order></author><author><firstname>H.M.</firstname><surname>Davies</surname><order>3</order></author><author><firstname>N.P.</firstname><surname>Lavery</surname><order>4</order></author><author><firstname>S.G.R.</firstname><surname>Brown</surname><order>5</order></author><author><firstname>J.</firstname><surname>Sienz</surname><order>6</order></author><author><firstname>A.</firstname><surname>Jones</surname><order>7</order></author><author><firstname>P.</firstname><surname>Sommerfeld</surname><order>8</order></author><author><firstname>Steve</firstname><surname>Brown</surname><order>9</order></author><author><firstname>Johann</firstname><surname>Sienz</surname><orcid>0000-0003-3136-5718</orcid><order>10</order></author><author><firstname>Nicholas</firstname><surname>Lavery</surname><orcid>0000-0003-0953-5936</orcid><order>11</order></author><author><firstname>Helen</firstname><surname>Davies</surname><orcid>0000-0003-4838-9572</orcid><order>12</order></author></authors><documents/><OutputDurs/></rfc1807> |
| spelling |
2019-03-29T18:18:53.0450769 v2 22172 2015-06-25 Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys 07a865adc76376646bc6c03a69ce35a9 Steve Brown Steve Brown true false 17bf1dd287bff2cb01b53d98ceb28a31 0000-0003-3136-5718 Johann Sienz Johann Sienz true false 9f102ff59824fd4f7ce3d40144304395 0000-0003-0953-5936 Nicholas Lavery Nicholas Lavery true false a5277aa17f0f10a481da9e9751ccaeef 0000-0003-4838-9572 Helen Davies Helen Davies true false 2015-06-25 FGSEN The primary aim of this investigation was to understand the effect of temperature fluctuations on a number of various solder materials namely SAC105, SAC305, SAC405 and Sn–36Pb–2Ag. To achieve this objective, three different classic joint assemblies (a ball joint, a test specimen joint and finger lead joint) were modeled which provided the foundation for the creep and fatigue behaviors simulation. Anand’s viscoplasticity as a constitutive equation was employed to characterize the behavior of solders numerically under the influence of thermal power cycles (80–150 °C) and thermal shock cycles (−40 to 125 °C). To extend the research outcome for industrial use, two additional research activities were carried out. One of them was to obtain lifetime-predictions of solder joints based on Coffin Manson concept. The other one focused on parameterization to obtain the ideal solder thickness under the consideration of plastic strain and economic benefit. Journal Article Microelectronics Reliability 54 6-7 1235 1242 0026-2714 30 6 2014 2014-06-30 10.1016/j.microrel.2014.02.017 COLLEGE NANME Science and Engineering - Faculty COLLEGE CODE FGSEN Swansea University 2019-03-29T18:18:53.0450769 2015-06-25T19:00:55.9174837 Faculty of Science and Engineering School of Engineering and Applied Sciences - Uncategorised J. Eckermann 1 S. Mehmood 2 H.M. Davies 3 N.P. Lavery 4 S.G.R. Brown 5 J. Sienz 6 A. Jones 7 P. Sommerfeld 8 Steve Brown 9 Johann Sienz 0000-0003-3136-5718 10 Nicholas Lavery 0000-0003-0953-5936 11 Helen Davies 0000-0003-4838-9572 12 |
| title |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys |
| spellingShingle |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys Steve Brown Johann Sienz Nicholas Lavery Helen Davies |
| title_short |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys |
| title_full |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys |
| title_fullStr |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys |
| title_full_unstemmed |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys |
| title_sort |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys |
| author_id_str_mv |
07a865adc76376646bc6c03a69ce35a9 17bf1dd287bff2cb01b53d98ceb28a31 9f102ff59824fd4f7ce3d40144304395 a5277aa17f0f10a481da9e9751ccaeef |
| author_id_fullname_str_mv |
07a865adc76376646bc6c03a69ce35a9_***_Steve Brown 17bf1dd287bff2cb01b53d98ceb28a31_***_Johann Sienz 9f102ff59824fd4f7ce3d40144304395_***_Nicholas Lavery a5277aa17f0f10a481da9e9751ccaeef_***_Helen Davies |
| author |
Steve Brown Johann Sienz Nicholas Lavery Helen Davies |
| author2 |
J. Eckermann S. Mehmood H.M. Davies N.P. Lavery S.G.R. Brown J. Sienz A. Jones P. Sommerfeld Steve Brown Johann Sienz Nicholas Lavery Helen Davies |
| format |
Journal article |
| container_title |
Microelectronics Reliability |
| container_volume |
54 |
| container_issue |
6-7 |
| container_start_page |
1235 |
| publishDate |
2014 |
| institution |
Swansea University |
| issn |
0026-2714 |
| doi_str_mv |
10.1016/j.microrel.2014.02.017 |
| college_str |
Faculty of Science and Engineering |
| hierarchytype |
|
| hierarchy_top_id |
facultyofscienceandengineering |
| hierarchy_top_title |
Faculty of Science and Engineering |
| hierarchy_parent_id |
facultyofscienceandengineering |
| hierarchy_parent_title |
Faculty of Science and Engineering |
| department_str |
School of Engineering and Applied Sciences - Uncategorised{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Uncategorised |
| document_store_str |
0 |
| active_str |
0 |
| description |
The primary aim of this investigation was to understand the effect of temperature fluctuations on a number of various solder materials namely SAC105, SAC305, SAC405 and Sn–36Pb–2Ag. To achieve this objective, three different classic joint assemblies (a ball joint, a test specimen joint and finger lead joint) were modeled which provided the foundation for the creep and fatigue behaviors simulation. Anand’s viscoplasticity as a constitutive equation was employed to characterize the behavior of solders numerically under the influence of thermal power cycles (80–150 °C) and thermal shock cycles (−40 to 125 °C). To extend the research outcome for industrial use, two additional research activities were carried out. One of them was to obtain lifetime-predictions of solder joints based on Coffin Manson concept. The other one focused on parameterization to obtain the ideal solder thickness under the consideration of plastic strain and economic benefit. |
| published_date |
2014-06-30T03:26:23Z |
| _version_ |
1763750952381186048 |
| score |
11.012924 |