Brown, S., Eckermann, J., Mehmood, S., Davies, H., Lavery, N., Brown, S., . . . Davies, H. (2014). Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys. Microelectronics Reliability, 54(6-7), pp. 1235-1242. doi:10.1016/j.microrel.2014.02.017

Brown, Steve, et al. "Computational Modeling of Creep-based Fatigue As a Means of Selecting Lead-free Solder Alloys." Microelectronics Reliability 54, no. 6-7 (2014): 1235-1242.

Brown, Steve, et al. "Computational Modeling of Creep-based Fatigue As a Means of Selecting Lead-free Solder Alloys." Microelectronics Reliability 54.6-7 (2014): 1235-1242.