Journal article 1884 views
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys
,
Nicholas Lavery ,
Helen Davies
Microelectronics Reliability, Volume: 54, Issue: 6-7, Pages: 1235 - 1242
Swansea University Authors:
Steve Brown, Johann Sienz , Nicholas Lavery , Helen Davies
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1016/j.microrel.2014.02.017
Abstract
The primary aim of this investigation was to understand the effect of temperature fluctuations on a number of various solder materials namely SAC105, SAC305, SAC405 and Sn–36Pb–2Ag. To achieve this objective, three different classic joint assemblies (a ball joint, a test specimen joint and finger le...
| Published in: | Microelectronics Reliability |
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| ISSN: | 0026-2714 |
| Published: |
2014
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| Online Access: |
Check full text
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa22172 |
| Abstract: |
The primary aim of this investigation was to understand the effect of temperature fluctuations on a number of various solder materials namely SAC105, SAC305, SAC405 and Sn–36Pb–2Ag. To achieve this objective, three different classic joint assemblies (a ball joint, a test specimen joint and finger lead joint) were modeled which provided the foundation for the creep and fatigue behaviors simulation. Anand’s viscoplasticity as a constitutive equation was employed to characterize the behavior of solders numerically under the influence of thermal power cycles (80–150 °C) and thermal shock cycles (−40 to 125 °C). To extend the research outcome for industrial use, two additional research activities were carried out. One of them was to obtain lifetime-predictions of solder joints based on Coffin Manson concept. The other one focused on parameterization to obtain the ideal solder thickness under the consideration of plastic strain and economic benefit. |
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| College: |
Faculty of Science and Engineering |
| Issue: |
6-7 |
| Start Page: |
1235 |
| End Page: |
1242 |