Conference Paper/Proceeding/Abstract 1216 views
Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Swansea University Authors:
Steve Brown, Nicholas Lavery
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DOI (Published version): 10.1109/EuroSimE.2013.6529901
Abstract
This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder al...
| Published in: | Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on |
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| Published: |
Wroclaw, Poland
IEEE Explore
2013
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| Online Access: |
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6529901&tag=1 |
| URI: | https://cronfa.swan.ac.uk/Record/cronfa15168 |
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| Abstract: |
This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder alloys including SAC105, SAC305, SAC405 and Sn-36Pb-2Ag. Both the impacts of thermal power cycles (80 to 150 °C) and thermal sh°Ck cycles (−40 to 125 °C) on solders were simulated by using the constitutive equation based on Anand's viscoplasticity model. From these results, lifetime-predictions of solder joints were derived using Coffin Manson procedures. |
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| Keywords: |
Lead free solder, computational modelling, creep-fatigue |
| College: |
Faculty of Science and Engineering |
| End Page: |
8 |