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Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys

J Eckermann, S Mehmood, H.M Davies, N. P Lavery, S.G.R Brown, J Sienz, A Jones, P Sommerfeld, Steve Brown, Nicholas Lavery Orcid Logo

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on

Swansea University Authors: Steve Brown, Nicholas Lavery Orcid Logo

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DOI (Published version): 10.1109/EuroSimE.2013.6529901

Abstract

This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder al...

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Published in: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Published: Wroclaw, Poland IEEE Explore 2013
Online Access: http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6529901&tag=1
URI: https://cronfa.swan.ac.uk/Record/cronfa15168
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spelling 2015-08-31T14:22:17.4662937 v2 15168 2013-07-05 Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys 07a865adc76376646bc6c03a69ce35a9 Steve Brown Steve Brown true false 9f102ff59824fd4f7ce3d40144304395 0000-0003-0953-5936 Nicholas Lavery Nicholas Lavery true false 2013-07-05 FGSEN This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder alloys including SAC105, SAC305, SAC405 and Sn-36Pb-2Ag. Both the impacts of thermal power cycles (80 to 150 °C) and thermal sh°Ck cycles (−40 to 125 °C) on solders were simulated by using the constitutive equation based on Anand's viscoplasticity model. From these results, lifetime-predictions of solder joints were derived using Coffin Manson procedures. Conference Paper/Proceeding/Abstract Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on 8 IEEE Explore Wroclaw, Poland Lead free solder, computational modelling, creep-fatigue 16 4 2013 2013-04-16 10.1109/EuroSimE.2013.6529901 http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6529901&amp;tag=1 COLLEGE NANME Science and Engineering - Faculty COLLEGE CODE FGSEN Swansea University 2015-08-31T14:22:17.4662937 2013-07-05T12:23:13.9458167 Faculty of Science and Engineering School of Engineering and Applied Sciences - Uncategorised J Eckermann 1 S Mehmood 2 H.M Davies 3 N. P Lavery 4 S.G.R Brown 5 J Sienz 6 A Jones 7 P Sommerfeld 8 Steve Brown 9 Nicholas Lavery 0000-0003-0953-5936 10
title Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
spellingShingle Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
Steve Brown
Nicholas Lavery
title_short Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
title_full Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
title_fullStr Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
title_full_unstemmed Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
title_sort Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
author_id_str_mv 07a865adc76376646bc6c03a69ce35a9
9f102ff59824fd4f7ce3d40144304395
author_id_fullname_str_mv 07a865adc76376646bc6c03a69ce35a9_***_Steve Brown
9f102ff59824fd4f7ce3d40144304395_***_Nicholas Lavery
author Steve Brown
Nicholas Lavery
author2 J Eckermann
S Mehmood
H.M Davies
N. P Lavery
S.G.R Brown
J Sienz
A Jones
P Sommerfeld
Steve Brown
Nicholas Lavery
format Conference Paper/Proceeding/Abstract
container_title Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
publishDate 2013
institution Swansea University
doi_str_mv 10.1109/EuroSimE.2013.6529901
publisher IEEE Explore
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Engineering and Applied Sciences - Uncategorised{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Uncategorised
url http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6529901&amp;tag=1
document_store_str 0
active_str 0
description This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder alloys including SAC105, SAC305, SAC405 and Sn-36Pb-2Ag. Both the impacts of thermal power cycles (80 to 150 °C) and thermal sh°Ck cycles (−40 to 125 °C) on solders were simulated by using the constitutive equation based on Anand's viscoplasticity model. From these results, lifetime-predictions of solder joints were derived using Coffin Manson procedures.
published_date 2013-04-16T03:17:17Z
_version_ 1763750379816747008
score 11.012924

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