Brown, S., Eckermann, J., Mehmood, S., Davies, H., Lavery, N. P., Brown, S., . . . Lavery, N. (2013). Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on, pp. -8. doi:10.1109/EuroSimE.2013.6529901

Brown, Steve, et al. "Computational Modelling of Creep-based Fatigue As a Means of Selecting Lead-free Solder Alloys." Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference On 2013: -8.

Brown, Steve, et al. "Computational Modelling of Creep-based Fatigue As a Means of Selecting Lead-free Solder Alloys." Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference On 2013: -8.