Journal article 20 views
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations
H.R. Kotadia,
A. Rahnama,
F. Tang,
J.I. Ahuir-Torres 
,
G. West,
Amit Das ,
S.H. Mannan
,
G. West,
Amit Das ,
S.H. Mannan
Materials & Design, Volume: 260, Start page: 115219
Swansea University Author:
Amit Das
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1016/j.matdes.2025.115219
Abstract
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations
| Published in: | Materials & Design |
|---|---|
| ISSN: | 0264-1275 |
| Published: |
Elsevier BV
2025
|
| Online Access: |
Check full text
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa71142 |
| first_indexed |
2025-12-12T14:30:14Z |
|---|---|
| last_indexed |
2025-12-13T05:31:12Z |
| id |
cronfa71142 |
| recordtype |
SURis |
| fullrecord |
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| spelling |
2025-12-12T14:30:13.1259039 v2 71142 2025-12-12 Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations 4d785df766daed9a857c934bb130ed8b 0000-0002-7196-6254 Amit Das Amit Das true false 2025-12-12 EAAS Journal Article Materials & Design 260 115219 Elsevier BV 0264-1275 29 11 2025 2025-11-29 10.1016/j.matdes.2025.115219 https://doi.org/10.1016/j.matdes.2025.115219 COLLEGE NANME Engineering and Applied Sciences School COLLEGE CODE EAAS Swansea University Another institution paid the OA fee EPSRC 2025-12-12T14:30:13.1259039 2025-12-12T14:22:26.4169021 H.R. Kotadia 1 A. Rahnama 2 F. Tang 3 J.I. Ahuir-Torres 0000-0002-3160-0223 4 G. West 5 Amit Das 0000-0002-7196-6254 6 S.H. Mannan 0000-0002-3452-6532 7 |
| title |
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations |
| spellingShingle |
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations Amit Das |
| title_short |
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations |
| title_full |
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations |
| title_fullStr |
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations |
| title_full_unstemmed |
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations |
| title_sort |
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations |
| author_id_str_mv |
4d785df766daed9a857c934bb130ed8b |
| author_id_fullname_str_mv |
4d785df766daed9a857c934bb130ed8b_***_Amit Das |
| author |
Amit Das |
| author2 |
H.R. Kotadia A. Rahnama F. Tang J.I. Ahuir-Torres G. West Amit Das S.H. Mannan |
| format |
Journal article |
| container_title |
Materials & Design |
| container_volume |
260 |
| container_start_page |
115219 |
| publishDate |
2025 |
| institution |
Swansea University |
| issn |
0264-1275 |
| doi_str_mv |
10.1016/j.matdes.2025.115219 |
| publisher |
Elsevier BV |
| url |
https://doi.org/10.1016/j.matdes.2025.115219 |
| document_store_str |
0 |
| active_str |
0 |
| published_date |
2025-11-29T05:28:10Z |
| _version_ |
1851641446150438912 |
| score |
11.089718 |