Journal article 15 views
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations
H.R. Kotadia,
A. Rahnama,
F. Tang,
J.I. Ahuir-Torres 
,
G. West,
Amit Das ,
S.H. Mannan
,
G. West,
Amit Das ,
S.H. Mannan
Materials & Design, Volume: 260, Start page: 115219
Swansea University Author:
Amit Das
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1016/j.matdes.2025.115219
Abstract
Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations
| Published in: | Materials & Design |
|---|---|
| ISSN: | 0264-1275 |
| Published: |
Elsevier BV
2025
|
| Online Access: |
Check full text
|
| URI: | https://cronfa.swan.ac.uk/Record/cronfa71142 |
| Funders: |
EPSRC |
|---|---|
| Start Page: |
115219 |