Journal article 216 views
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 14, Issue: 2, Pages: 342 - 348
Swansea University Author:
Yaonan Hou
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1109/tcpmt.2023.3341329
Abstract
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
Published in: | IEEE Transactions on Components, Packaging and Manufacturing Technology |
---|---|
ISSN: | 2156-3950 2156-3985 |
Published: |
Institute of Electrical and Electronics Engineers (IEEE)
2024
|
Online Access: |
Check full text
|
URI: | https://cronfa.swan.ac.uk/Record/cronfa67690 |
first_indexed |
2024-09-25T19:10:06Z |
---|---|
last_indexed |
2024-11-25T14:20:38Z |
id |
cronfa67690 |
recordtype |
SURis |
fullrecord |
<?xml version="1.0"?><rfc1807><datestamp>2024-10-24T14:07:57.3837319</datestamp><bib-version>v2</bib-version><id>67690</id><entry>2024-09-14</entry><title>Wafer Bonding for Processing Small Wafers in Large Wafer Facilities</title><swanseaauthors><author><sid>113975f710084997abdb26ad5fa03e8e</sid><ORCID>0000-0001-9461-3841</ORCID><firstname>Yaonan</firstname><surname>Hou</surname><name>Yaonan Hou</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2024-09-14</date><deptcode>ACEM</deptcode><abstract/><type>Journal Article</type><journal>IEEE Transactions on Components, Packaging and Manufacturing Technology</journal><volume>14</volume><journalNumber>2</journalNumber><paginationStart>342</paginationStart><paginationEnd>348</paginationEnd><publisher>Institute of Electrical and Electronics Engineers (IEEE)</publisher><placeOfPublication/><isbnPrint/><isbnElectronic/><issnPrint>2156-3950</issnPrint><issnElectronic>2156-3985</issnElectronic><keywords>Etching, Resists, Photonics, Wafer bonding, Adhesives, Lithography, Fabrication, Semiconductor waveguides</keywords><publishedDay>11</publishedDay><publishedMonth>3</publishedMonth><publishedYear>2024</publishedYear><publishedDate>2024-03-11</publishedDate><doi>10.1109/tcpmt.2023.3341329</doi><url/><notes/><college>COLLEGE NANME</college><department>Aerospace, Civil, Electrical, and Mechanical Engineering</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>ACEM</DepartmentCode><institution>Swansea University</institution><apcterm>Not Required</apcterm><funders>This work was supported by the Engineering
and Physical Sciences Research Council (EPSRC) under Grant EP/T028475/1
[QUantum DOts on Silicon systems for communications, information processing and sensing (QUDOS)] and Grant EP/V007629/1 (correlative Raman,
SEM, and Energy Dispersive X-ray Spectroscopy (EDX) for operando electrochemistry research).</funders><projectreference/><lastEdited>2024-10-24T14:07:57.3837319</lastEdited><Created>2024-09-14T10:10:43.3025239</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Civil Engineering</level></path><authors><author><firstname>Yasir J.</firstname><surname>Noori</surname><orcid>0000-0001-5285-8779</orcid><order>1</order></author><author><firstname>Ilias</firstname><surname>Skandalos</surname><orcid>0000-0002-9021-1420</orcid><order>2</order></author><author><firstname>Xingzhao</firstname><surname>Yan</surname><orcid>0000-0002-2466-3015</orcid><order>3</order></author><author><firstname>Nikolay</firstname><surname>Zhelev</surname><order>4</order></author><author><firstname>Yaonan</firstname><surname>Hou</surname><orcid>0000-0001-9461-3841</orcid><order>5</order></author><author><firstname>Frederic</firstname><surname>Gardes</surname><order>6</order></author></authors><documents/><OutputDurs/></rfc1807> |
spelling |
2024-10-24T14:07:57.3837319 v2 67690 2024-09-14 Wafer Bonding for Processing Small Wafers in Large Wafer Facilities 113975f710084997abdb26ad5fa03e8e 0000-0001-9461-3841 Yaonan Hou Yaonan Hou true false 2024-09-14 ACEM Journal Article IEEE Transactions on Components, Packaging and Manufacturing Technology 14 2 342 348 Institute of Electrical and Electronics Engineers (IEEE) 2156-3950 2156-3985 Etching, Resists, Photonics, Wafer bonding, Adhesives, Lithography, Fabrication, Semiconductor waveguides 11 3 2024 2024-03-11 10.1109/tcpmt.2023.3341329 COLLEGE NANME Aerospace, Civil, Electrical, and Mechanical Engineering COLLEGE CODE ACEM Swansea University Not Required This work was supported by the Engineering and Physical Sciences Research Council (EPSRC) under Grant EP/T028475/1 [QUantum DOts on Silicon systems for communications, information processing and sensing (QUDOS)] and Grant EP/V007629/1 (correlative Raman, SEM, and Energy Dispersive X-ray Spectroscopy (EDX) for operando electrochemistry research). 2024-10-24T14:07:57.3837319 2024-09-14T10:10:43.3025239 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Civil Engineering Yasir J. Noori 0000-0001-5285-8779 1 Ilias Skandalos 0000-0002-9021-1420 2 Xingzhao Yan 0000-0002-2466-3015 3 Nikolay Zhelev 4 Yaonan Hou 0000-0001-9461-3841 5 Frederic Gardes 6 |
title |
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities |
spellingShingle |
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities Yaonan Hou |
title_short |
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities |
title_full |
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities |
title_fullStr |
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities |
title_full_unstemmed |
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities |
title_sort |
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities |
author_id_str_mv |
113975f710084997abdb26ad5fa03e8e |
author_id_fullname_str_mv |
113975f710084997abdb26ad5fa03e8e_***_Yaonan Hou |
author |
Yaonan Hou |
author2 |
Yasir J. Noori Ilias Skandalos Xingzhao Yan Nikolay Zhelev Yaonan Hou Frederic Gardes |
format |
Journal article |
container_title |
IEEE Transactions on Components, Packaging and Manufacturing Technology |
container_volume |
14 |
container_issue |
2 |
container_start_page |
342 |
publishDate |
2024 |
institution |
Swansea University |
issn |
2156-3950 2156-3985 |
doi_str_mv |
10.1109/tcpmt.2023.3341329 |
publisher |
Institute of Electrical and Electronics Engineers (IEEE) |
college_str |
Faculty of Science and Engineering |
hierarchytype |
|
hierarchy_top_id |
facultyofscienceandengineering |
hierarchy_top_title |
Faculty of Science and Engineering |
hierarchy_parent_id |
facultyofscienceandengineering |
hierarchy_parent_title |
Faculty of Science and Engineering |
department_str |
School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Civil Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Civil Engineering |
document_store_str |
0 |
active_str |
0 |
published_date |
2024-03-11T07:37:04Z |
_version_ |
1836697281454145536 |
score |
11.067306 |