Journal article 150 views
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
Yasir J. Noori 
,
Ilias Skandalos ,
Xingzhao Yan ,
Nikolay Zhelev,
Yaonan Hou ,
Frederic Gardes
,
Ilias Skandalos ,
Xingzhao Yan ,
Nikolay Zhelev,
Yaonan Hou ,
Frederic Gardes
IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 14, Issue: 2, Pages: 342 - 348
Swansea University Author:
Yaonan Hou
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1109/tcpmt.2023.3341329
Abstract
Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
| Published in: | IEEE Transactions on Components, Packaging and Manufacturing Technology |
|---|---|
| ISSN: | 2156-3950 2156-3985 |
| Published: |
Institute of Electrical and Electronics Engineers (IEEE)
2024
|
| Online Access: |
Check full text
|
| URI: | https://cronfa.swan.ac.uk/Record/cronfa67690 |
| Keywords: |
Etching, Resists, Photonics, Wafer bonding, Adhesives, Lithography, Fabrication, Semiconductor waveguides |
|---|---|
| College: |
Faculty of Science and Engineering |
| Funders: |
This work was supported by the Engineering
and Physical Sciences Research Council (EPSRC) under Grant EP/T028475/1
[QUantum DOts on Silicon systems for communications, information processing and sensing (QUDOS)] and Grant EP/V007629/1 (correlative Raman,
SEM, and Energy Dispersive X-ray Spectroscopy (EDX) for operando electrochemistry research). |
| Issue: |
2 |
| Start Page: |
342 |
| End Page: |
348 |