Journal article 1096 views
Si/SiC bonded wafer: A route to carbon free SiO[sub 2] on SiC
A Pérez-Tomás,
M Lodzinski,
O. J Guy,
M. R Jennings,
M Placidi,
J Llobet,
P. M Gammon,
M. C Davis,
J. A Covington,
S. E Burrows,
P. A Mawby,
Owen Guy 
Applied Physics Letters, Volume: 94, Issue: 10, Start page: 103510
Swansea University Author:
Owen Guy
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1063/1.3099018
Abstract
Si/SiC bonded wafer: A route to carbon free SiO[sub 2] on SiC
| Published in: | Applied Physics Letters |
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| ISSN: | 0003-6951 |
| Published: |
2009
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| Online Access: |
Check full text
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa5657 |
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| Item Description: |
This project developed a MEMS-based electro-osmotic pump originally for application in heat-transfer in semiconductor chips. An applied voltage pumped an ionic solution through a series of microfulidic channels resulting in a cooling effect on the semiconductor wafer and spreading heat from localised device hot-spots.The technology is now being developed for biochip applications, pumping tiny volumes of fluids to biochip sensors.It has lead to industrial interaction with etch tool manufacturer SPTS and a resulting 3-year £176k project.This is a key eneabling technology for many of the nanohealth developments at Swansea. |
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| College: |
Faculty of Science and Engineering |
| Issue: |
10 |
| Start Page: |
103510 |