Conference Paper/Proceeding/Abstract 945 views
Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation
Amit Das 
Proceedings of the 6th Decennial International Conference on Solidification Processing
Swansea University Author:
Amit Das
Abstract
Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation
| Published in: | Proceedings of the 6th Decennial International Conference on Solidification Processing |
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| ISBN: | 978-1908549297 |
| Published: |
2017
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa34577 |
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| Keywords: |
solidification, Sn-Cu solder, Intermetallic compounds (IMCs), Pb-free solder |
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| College: |
Faculty of Science and Engineering |