Journal article 1319 views
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs
IEEE Transactions on Electron Devices, Volume: 63, Issue: 3, Pages: 1209 - 1216
Swansea University Author: Karol Kalna
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DOI (Published version): 10.1109/TED.2016.2516921
Abstract
The fin-edge roughness and the TiN metal grain work function-induced variability affecting device characteristics are studied and compared between a 10.4-nm gate length In0.53Ga0.47As FinFET and a 10.7-nm gate length Si FinFET. We have analysed the impact of variability by looking on five figures of...
Published in: | IEEE Transactions on Electron Devices |
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ISSN: | 0018-9383 1557-9646 |
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2016
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URI: | https://cronfa.swan.ac.uk/Record/cronfa27207 |
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2022-10-10T15:50:04.3513587 v2 27207 2016-04-19 Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs 1329a42020e44fdd13de2f20d5143253 0000-0002-6333-9189 Karol Kalna Karol Kalna true false 2016-04-19 ACEM The fin-edge roughness and the TiN metal grain work function-induced variability affecting device characteristics are studied and compared between a 10.4-nm gate length In0.53Ga0.47As FinFET and a 10.7-nm gate length Si FinFET. We have analysed the impact of variability by looking on five figures of merit (threshold voltage, sub-threshold slope, off-current, DIBL, and on-current) using the two state-of-the-art in-house-build 3-D simulation tools based on the finite-element method. Quantum-corrected 3-D drift-diffusion simulations are employed for variability studies in the sub-threshold region while, in the ON-rwillegion, we use quantum-corrected 3-D ensemble Monte Carlo simulations. The In0.53Ga0.47As FinFET is more resistant to the fin-edge roughness and metal grain work function variability in the sub-threshold compared with the Si FinFET due to a stronger quantum carrier confinement present in the In0.53Ga0.47As channel. However, the ON-current variability is between 1.1 and 2.2 times larger for the In0.53Ga0.47As FinFET than for the Si transistor, respectively.will Journal Article IEEE Transactions on Electron Devices 63 3 1209 1216 0018-9383 1557-9646 31 3 2016 2016-03-31 10.1109/TED.2016.2516921 http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7393821 COLLEGE NANME Aerospace, Civil, Electrical, and Mechanical Engineering COLLEGE CODE ACEM Swansea University EC, EPSRC 2022-10-10T15:50:04.3513587 2016-04-19T12:52:47.9770898 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering Natalia Seoane 1 Guillermo Indalecio 2 Manuel Aldegunde 3 Daniel Nagy 4 Muhammad A. Elmessary 5 Antonio J. Garcia-Loureiro 6 Karol Kalna 0000-0002-6333-9189 7 |
title |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
spellingShingle |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs Karol Kalna |
title_short |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
title_full |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
title_fullStr |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
title_full_unstemmed |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
title_sort |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
author_id_str_mv |
1329a42020e44fdd13de2f20d5143253 |
author_id_fullname_str_mv |
1329a42020e44fdd13de2f20d5143253_***_Karol Kalna |
author |
Karol Kalna |
author2 |
Natalia Seoane Guillermo Indalecio Manuel Aldegunde Daniel Nagy Muhammad A. Elmessary Antonio J. Garcia-Loureiro Karol Kalna |
format |
Journal article |
container_title |
IEEE Transactions on Electron Devices |
container_volume |
63 |
container_issue |
3 |
container_start_page |
1209 |
publishDate |
2016 |
institution |
Swansea University |
issn |
0018-9383 1557-9646 |
doi_str_mv |
10.1109/TED.2016.2516921 |
college_str |
Faculty of Science and Engineering |
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|
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facultyofscienceandengineering |
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Faculty of Science and Engineering |
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facultyofscienceandengineering |
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Faculty of Science and Engineering |
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School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering |
url |
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7393821 |
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description |
The fin-edge roughness and the TiN metal grain work function-induced variability affecting device characteristics are studied and compared between a 10.4-nm gate length In0.53Ga0.47As FinFET and a 10.7-nm gate length Si FinFET. We have analysed the impact of variability by looking on five figures of merit (threshold voltage, sub-threshold slope, off-current, DIBL, and on-current) using the two state-of-the-art in-house-build 3-D simulation tools based on the finite-element method. Quantum-corrected 3-D drift-diffusion simulations are employed for variability studies in the sub-threshold region while, in the ON-rwillegion, we use quantum-corrected 3-D ensemble Monte Carlo simulations. The In0.53Ga0.47As FinFET is more resistant to the fin-edge roughness and metal grain work function variability in the sub-threshold compared with the Si FinFET due to a stronger quantum carrier confinement present in the In0.53Ga0.47As channel. However, the ON-current variability is between 1.1 and 2.2 times larger for the In0.53Ga0.47As FinFET than for the Si transistor, respectively.will |
published_date |
2016-03-31T06:54:34Z |
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1821387495269466112 |
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11.047501 |