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Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment

David Pervan, Anil Bastola Orcid Logo, Robyn Worsley, Ricky Wildman Orcid Logo, Richard Hague, Edward Lester Orcid Logo, Christopher Tuck Orcid Logo

Nanomaterials, Volume: 14, Issue: 9, Start page: 753

Swansea University Author: Anil Bastola Orcid Logo

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DOI (Published version): 10.3390/nano14090753

Abstract

The additive manufacturing (AM) of functional copper (Cu) parts is a major goal for many industries, from aerospace to automotive to electronics, because Cu has a high thermal and electrical conductivity as well as being ~10× cheaper than silver. Previous studies on AM of Cu have concentrated mainly...

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Published in: Nanomaterials
ISSN: 2079-4991
Published: MDPI AG 2024
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URI: https://cronfa.swan.ac.uk/Record/cronfa68150
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spelling 2025-02-13T12:11:20.8502939 v2 68150 2024-11-02 Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment 6775d40c935b36b92058eb10d6454f1a 0000-0002-5598-0849 Anil Bastola Anil Bastola true false 2024-11-02 ACEM The additive manufacturing (AM) of functional copper (Cu) parts is a major goal for many industries, from aerospace to automotive to electronics, because Cu has a high thermal and electrical conductivity as well as being ~10× cheaper than silver. Previous studies on AM of Cu have concentrated mainly on high-energy manufacturing processes such as Laser Powder Bed Fusion, Electron Beam Melting, and Binder Jetting. These processes all require high-temperature heat treatment in an oxygen-free environment. This paper shows an AM route to multi-layered microparts from novel nanoparticle (NP) Cu feedstocks, performed in an air environment, employing a low-power (<10 W) laser sintering process. Cu NP ink was deposited using two mechanisms, inkjet printing, and bar coating, followed by low-power laser exposure to induce particle consolidation. Initial parts were manufactured to a height of approximately 100 µm, which was achieved by multi-layer printing of 15 (bar-coated) to 300 (inkjetted) layers. There was no evidence of oxidised copper in the sintered material, but they were found to be low-density, porous structures. Nonetheless, electrical resistivity of ~28 × 10−8 Ω m was achieved. Overall, the aim of this study is to offer foundational knowledge for upscaling the process to additively manufacture Cu 3D parts of significant size via sequential nanometal ink deposition and low-power laser processing. Journal Article Nanomaterials 14 9 753 MDPI AG 2079-4991 Additive manufacturing; inkjet; copper; nanoparticles; multi-layer 25 4 2024 2024-04-25 10.3390/nano14090753 COLLEGE NANME Aerospace, Civil, Electrical, and Mechanical Engineering COLLEGE CODE ACEM Swansea University Another institution paid the OA fee This research received no external funding. 2025-02-13T12:11:20.8502939 2024-11-02T16:18:09.0202725 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering David Pervan 1 Anil Bastola 0000-0002-5598-0849 2 Robyn Worsley 3 Ricky Wildman 0000-0003-2329-8471 4 Richard Hague 5 Edward Lester 0000-0003-1060-103x 6 Christopher Tuck 0000-0003-0146-3851 7 68150__33271__4172ad5dd5f7406b9714e18eeda2f3fa.pdf 68150.VOR.pdf 2025-01-09T11:13:11.0499977 Output 3518596 application/pdf Version of Record true © 2024 by the authors. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license. true eng https://creativecommons.org/licenses/by/4.0/
title Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
spellingShingle Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
Anil Bastola
title_short Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
title_full Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
title_fullStr Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
title_full_unstemmed Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
title_sort Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
author_id_str_mv 6775d40c935b36b92058eb10d6454f1a
author_id_fullname_str_mv 6775d40c935b36b92058eb10d6454f1a_***_Anil Bastola
author Anil Bastola
author2 David Pervan
Anil Bastola
Robyn Worsley
Ricky Wildman
Richard Hague
Edward Lester
Christopher Tuck
format Journal article
container_title Nanomaterials
container_volume 14
container_issue 9
container_start_page 753
publishDate 2024
institution Swansea University
issn 2079-4991
doi_str_mv 10.3390/nano14090753
publisher MDPI AG
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering
document_store_str 1
active_str 0
description The additive manufacturing (AM) of functional copper (Cu) parts is a major goal for many industries, from aerospace to automotive to electronics, because Cu has a high thermal and electrical conductivity as well as being ~10× cheaper than silver. Previous studies on AM of Cu have concentrated mainly on high-energy manufacturing processes such as Laser Powder Bed Fusion, Electron Beam Melting, and Binder Jetting. These processes all require high-temperature heat treatment in an oxygen-free environment. This paper shows an AM route to multi-layered microparts from novel nanoparticle (NP) Cu feedstocks, performed in an air environment, employing a low-power (<10 W) laser sintering process. Cu NP ink was deposited using two mechanisms, inkjet printing, and bar coating, followed by low-power laser exposure to induce particle consolidation. Initial parts were manufactured to a height of approximately 100 µm, which was achieved by multi-layer printing of 15 (bar-coated) to 300 (inkjetted) layers. There was no evidence of oxidised copper in the sintered material, but they were found to be low-density, porous structures. Nonetheless, electrical resistivity of ~28 × 10−8 Ω m was achieved. Overall, the aim of this study is to offer foundational knowledge for upscaling the process to additively manufacture Cu 3D parts of significant size via sequential nanometal ink deposition and low-power laser processing.
published_date 2024-04-25T18:28:16Z
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score 11.059359

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