Journal article 389 views
Multi-material additive-manufacturing of tungsten - copper alloy bimetallic structure with a stainless-steel interlayer and associated bonding mechanisms
Chao Wei,
Michael Liu,
Yuchen Gu,
Yihe Huang,
Qian Chen,
Zhaoqing Li,
Lin Li
Additive Manufacturing, Volume: 50, Start page: 102574
Swansea University Authors: Michael Liu, Yuchen Gu
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1016/j.addma.2021.102574
Abstract
Multi-material additive-manufacturing of tungsten - copper alloy bimetallic structure with a stainless-steel interlayer and associated bonding mechanisms
| Published in: | Additive Manufacturing |
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| ISSN: | 2214-8604 |
| Published: |
Elsevier BV
2022
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| Online Access: |
Check full text
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa60842 |
| Keywords: |
Laser-based powder bed fusion; Multi-material; Bimetallic interface; Copper alloy; Tungsten |
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| College: |
Faculty of Science and Engineering |
| Funders: |
This work was supported by the Engineering and Physical Science Research Council (EPSRC), UK (Grant Ref: EP/P027563/1). The authors would also like to acknowledge the support of the Bridging for Innovators Programme funded by BEIS, UK, the Science and Technology Facilities Council (STFC), UK (Grant No. ST/R006105/1), and the EPSRC, UK (Grant No. EP/M028267/1) for the use of AIM Facility at Swansea University, UK. |
| Start Page: |
102574 |