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Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment / HARRY FULTON

Swansea University Author: HARRY FULTON

  • Redacted version - open access under embargo until: 4th November 2026

DOI (Published version): 10.23889/SUthesis.58978

Abstract

This thesis describes an investigation of the suitability of standard semiconductor dicing tape when used in plasma dicing applications. The traditional methods of dividing a fully processed semiconductor wafer into individual integrated circuits are cleaving, sawing or laser based. These are all ph...

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Published: Swansea 2021
Institution: Swansea University
Degree level: Doctoral
Degree name: Ph.D
Supervisor: Li, Lijie
URI: https://cronfa.swan.ac.uk/Record/cronfa58978
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first_indexed 2021-12-08T16:29:50Z
last_indexed 2021-12-09T04:17:29Z
id cronfa58978
recordtype RisThesis
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spelling 2021-12-08T16:49:29.6080101 v2 58978 2021-12-08 Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment 849770072880aeaee8e6e47aa3d8d2bb HARRY FULTON HARRY FULTON true false 2021-12-08 This thesis describes an investigation of the suitability of standard semiconductor dicing tape when used in plasma dicing applications. The traditional methods of dividing a fully processed semiconductor wafer into individual integrated circuits are cleaving, sawing or laser based. These are all physical techniques and tape properties have been developed to ensure optimum performance for these processes. Conversely, plasma dicing is less physical as the material between each device is eliminated at the atomic level using a gentle chemical process. The properties of standard dicing tapes have been designed to withstand the rigors of the well-established device singulation techniques. However, they have not been fully investigated when exposed to a high vacuum plasma environment. The aim of this program of work was to characterise the performance of dicing tape when subjected to conditions unique to those in a plasma dicing reactor. Results have helped in providing more accurate tape recommendations to semiconductor IC fabrication companies but with the involvement of several major dicing tape manufacturers, have also served as the insight and motivation to support further development of dicing tape for use in plasma dicing throughout the industry. E-Thesis Swansea dicing tape, adhesion, plasma, singulation, UVtape, cross-linking, anti-ESD 8 12 2021 2021-12-08 10.23889/SUthesis.58978 A selection of third party content is redacted or is partially redacted from this thesis due to copyright restrictions.ORCiD identifier: https://orcid.org/0000-0002-9700-2314 COLLEGE NANME COLLEGE CODE Swansea University Li, Lijie Doctoral Ph.D SPTS Technologies Ltd 2021-12-08T16:49:29.6080101 2021-12-08T16:25:16.3182336 Faculty of Science and Engineering School of Engineering and Applied Sciences - Uncategorised HARRY FULTON 1 Under embargo Under embargo 2021-12-08T16:41:21.7252274 Output 7745085 application/pdf Redacted version - open access true 2026-11-04T00:00:00.0000000 Copyright: The author, Harry S. Fulton, 2021. true eng
title Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment
spellingShingle Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment
HARRY FULTON
title_short Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment
title_full Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment
title_fullStr Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment
title_full_unstemmed Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment
title_sort Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment
author_id_str_mv 849770072880aeaee8e6e47aa3d8d2bb
author_id_fullname_str_mv 849770072880aeaee8e6e47aa3d8d2bb_***_HARRY FULTON
author HARRY FULTON
author2 HARRY FULTON
format E-Thesis
publishDate 2021
institution Swansea University
doi_str_mv 10.23889/SUthesis.58978
college_str Faculty of Science and Engineering
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hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Engineering and Applied Sciences - Uncategorised{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Uncategorised
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description This thesis describes an investigation of the suitability of standard semiconductor dicing tape when used in plasma dicing applications. The traditional methods of dividing a fully processed semiconductor wafer into individual integrated circuits are cleaving, sawing or laser based. These are all physical techniques and tape properties have been developed to ensure optimum performance for these processes. Conversely, plasma dicing is less physical as the material between each device is eliminated at the atomic level using a gentle chemical process. The properties of standard dicing tapes have been designed to withstand the rigors of the well-established device singulation techniques. However, they have not been fully investigated when exposed to a high vacuum plasma environment. The aim of this program of work was to characterise the performance of dicing tape when subjected to conditions unique to those in a plasma dicing reactor. Results have helped in providing more accurate tape recommendations to semiconductor IC fabrication companies but with the involvement of several major dicing tape manufacturers, have also served as the insight and motivation to support further development of dicing tape for use in plasma dicing throughout the industry.
published_date 2021-12-08T04:15:55Z
_version_ 1763754068816166912
score 11.013641

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