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Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process

Olivia Howells, Gareth Blayney, Benedetta Gualeni, James C. Birchall, Pey F. Eng, Huma Ashraf, Sanjiv Sharma Orcid Logo, Owen Guy Orcid Logo

European Journal of Pharmaceutics and Biopharmaceutics, Volume: 171, Pages: 19 - 28

Swansea University Authors: Olivia Howells, Gareth Blayney, Sanjiv Sharma Orcid Logo, Owen Guy Orcid Logo

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DOI (Published version): 10.1016/j.ejpb.2021.06.005

Abstract

The fabrication of silicon in-plane microneedle arrays from a simple single wet etch step is presented. The characteristic 54.7° sidewall etch angle obtained via KOH etching of (100) orientation silicon wafers has been used to create a novel microneedle design. The KOH simultaneously etches both the...

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Published in: European Journal of Pharmaceutics and Biopharmaceutics
ISSN: 0939-6411
Published: Elsevier BV 2022
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URI: https://cronfa.swan.ac.uk/Record/cronfa57114
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The characteristic 54.7&#xB0; sidewall etch angle obtained via KOH etching of (100) orientation silicon wafers has been used to create a novel microneedle design. The KOH simultaneously etches both the front and back sides of the wafer to produce V shaped grooves, that intersect to form a sharp pyramidal six-sided microneedle tip. This method allows fabrication of solid microneedles with different geometries to determine the optimal microneedle length and width for effective penetration and minimally invasive drug delivery. A modified grooved microneedle design can also be used to create a hollow microneedle, via bonding of two grooved microneedles together, creating an enclosed hollow channel. The microneedle arrays developed, effectively penetrate the skin without significant indentation, thereby enabling effective delivery of active ingredients via either a poke and patch application using solid microneedles or direct injection using hollow microneedles. This simple, scalable and cost effective method utilises KOH to etch the silicon wafer in-plane, allowing microneedles with variable length of several mm to be fabricated, as opposed to out-of-plane MNs, which are geometrically restricted to dimensions less than the thickness of the wafer. These microneedle arrays have been used to demonstrate effective delivery of insulin and hyaluronic acid into the skin.</abstract><type>Journal Article</type><journal>European Journal of Pharmaceutics and Biopharmaceutics</journal><volume>171</volume><journalNumber/><paginationStart>19</paginationStart><paginationEnd>28</paginationEnd><publisher>Elsevier BV</publisher><placeOfPublication/><isbnPrint/><isbnElectronic/><issnPrint>0939-6411</issnPrint><issnElectronic/><keywords>Microneedle, drug delivery, silicon, fabrication</keywords><publishedDay>1</publishedDay><publishedMonth>2</publishedMonth><publishedYear>2022</publishedYear><publishedDate>2022-02-01</publishedDate><doi>10.1016/j.ejpb.2021.06.005</doi><url/><notes/><college>COLLEGE NANME</college><department>Engineering</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>EEN</DepartmentCode><institution>Swansea University</institution><apcterm/><lastEdited>2022-01-24T15:19:04.4165734</lastEdited><Created>2021-06-14T10:08:12.5368526</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Engineering and Applied Sciences - Chemistry</level></path><authors><author><firstname>Olivia</firstname><surname>Howells</surname><order>1</order></author><author><firstname>Gareth</firstname><surname>Blayney</surname><orcid/><order>2</order></author><author><firstname>Benedetta</firstname><surname>Gualeni</surname><order>3</order></author><author><firstname>James C.</firstname><surname>Birchall</surname><order>4</order></author><author><firstname>Pey F.</firstname><surname>Eng</surname><order>5</order></author><author><firstname>Huma</firstname><surname>Ashraf</surname><order>6</order></author><author><firstname>Sanjiv</firstname><surname>Sharma</surname><orcid>0000-0003-3828-737X</orcid><order>7</order></author><author><firstname>Owen</firstname><surname>Guy</surname><orcid>0000-0002-6449-4033</orcid><order>8</order></author></authors><documents><document><filename>57114__20153__bcbfe8001cc642a09158cea11833b531.pdf</filename><originalFilename>57114.pdf</originalFilename><uploaded>2021-06-14T15:25:34.8528627</uploaded><type>Output</type><contentLength>2332963</contentLength><contentType>application/pdf</contentType><version>Accepted Manuscript</version><cronfaStatus>true</cronfaStatus><embargoDate>2022-06-16T00:00:00.0000000</embargoDate><documentNotes>&#xA9;2021 All rights reserved. All article content, except where otherwise noted, is licensed under a Creative Commons Attribution Non-Commercial No Derivatives License (CC-BY-NC-ND)</documentNotes><copyrightCorrect>true</copyrightCorrect><language>eng</language><licence>http://creativecommons.org/licenses/by-nc-nd/4.0/</licence></document></documents><OutputDurs/></rfc1807>
spelling 2022-01-24T15:19:04.4165734 v2 57114 2021-06-14 Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process 1671197a20167685b9ff36aa67e5ebfc Olivia Howells Olivia Howells true false 272f5b85ba4d061380541dcd89d22ac0 Gareth Blayney Gareth Blayney true false b6b7506358522f607b171ec9c94757b7 0000-0003-3828-737X Sanjiv Sharma Sanjiv Sharma true false c7fa5949b8528e048c5b978005f66794 0000-0002-6449-4033 Owen Guy Owen Guy true false 2021-06-14 EEN The fabrication of silicon in-plane microneedle arrays from a simple single wet etch step is presented. The characteristic 54.7° sidewall etch angle obtained via KOH etching of (100) orientation silicon wafers has been used to create a novel microneedle design. The KOH simultaneously etches both the front and back sides of the wafer to produce V shaped grooves, that intersect to form a sharp pyramidal six-sided microneedle tip. This method allows fabrication of solid microneedles with different geometries to determine the optimal microneedle length and width for effective penetration and minimally invasive drug delivery. A modified grooved microneedle design can also be used to create a hollow microneedle, via bonding of two grooved microneedles together, creating an enclosed hollow channel. The microneedle arrays developed, effectively penetrate the skin without significant indentation, thereby enabling effective delivery of active ingredients via either a poke and patch application using solid microneedles or direct injection using hollow microneedles. This simple, scalable and cost effective method utilises KOH to etch the silicon wafer in-plane, allowing microneedles with variable length of several mm to be fabricated, as opposed to out-of-plane MNs, which are geometrically restricted to dimensions less than the thickness of the wafer. These microneedle arrays have been used to demonstrate effective delivery of insulin and hyaluronic acid into the skin. Journal Article European Journal of Pharmaceutics and Biopharmaceutics 171 19 28 Elsevier BV 0939-6411 Microneedle, drug delivery, silicon, fabrication 1 2 2022 2022-02-01 10.1016/j.ejpb.2021.06.005 COLLEGE NANME Engineering COLLEGE CODE EEN Swansea University 2022-01-24T15:19:04.4165734 2021-06-14T10:08:12.5368526 Faculty of Science and Engineering School of Engineering and Applied Sciences - Chemistry Olivia Howells 1 Gareth Blayney 2 Benedetta Gualeni 3 James C. Birchall 4 Pey F. Eng 5 Huma Ashraf 6 Sanjiv Sharma 0000-0003-3828-737X 7 Owen Guy 0000-0002-6449-4033 8 57114__20153__bcbfe8001cc642a09158cea11833b531.pdf 57114.pdf 2021-06-14T15:25:34.8528627 Output 2332963 application/pdf Accepted Manuscript true 2022-06-16T00:00:00.0000000 ©2021 All rights reserved. All article content, except where otherwise noted, is licensed under a Creative Commons Attribution Non-Commercial No Derivatives License (CC-BY-NC-ND) true eng http://creativecommons.org/licenses/by-nc-nd/4.0/
title Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process
spellingShingle Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process
Olivia Howells
Gareth Blayney
Sanjiv Sharma
Owen Guy
title_short Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process
title_full Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process
title_fullStr Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process
title_full_unstemmed Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process
title_sort Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process
author_id_str_mv 1671197a20167685b9ff36aa67e5ebfc
272f5b85ba4d061380541dcd89d22ac0
b6b7506358522f607b171ec9c94757b7
c7fa5949b8528e048c5b978005f66794
author_id_fullname_str_mv 1671197a20167685b9ff36aa67e5ebfc_***_Olivia Howells
272f5b85ba4d061380541dcd89d22ac0_***_Gareth Blayney
b6b7506358522f607b171ec9c94757b7_***_Sanjiv Sharma
c7fa5949b8528e048c5b978005f66794_***_Owen Guy
author Olivia Howells
Gareth Blayney
Sanjiv Sharma
Owen Guy
author2 Olivia Howells
Gareth Blayney
Benedetta Gualeni
James C. Birchall
Pey F. Eng
Huma Ashraf
Sanjiv Sharma
Owen Guy
format Journal article
container_title European Journal of Pharmaceutics and Biopharmaceutics
container_volume 171
container_start_page 19
publishDate 2022
institution Swansea University
issn 0939-6411
doi_str_mv 10.1016/j.ejpb.2021.06.005
publisher Elsevier BV
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Engineering and Applied Sciences - Chemistry{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Chemistry
document_store_str 1
active_str 0
description The fabrication of silicon in-plane microneedle arrays from a simple single wet etch step is presented. The characteristic 54.7° sidewall etch angle obtained via KOH etching of (100) orientation silicon wafers has been used to create a novel microneedle design. The KOH simultaneously etches both the front and back sides of the wafer to produce V shaped grooves, that intersect to form a sharp pyramidal six-sided microneedle tip. This method allows fabrication of solid microneedles with different geometries to determine the optimal microneedle length and width for effective penetration and minimally invasive drug delivery. A modified grooved microneedle design can also be used to create a hollow microneedle, via bonding of two grooved microneedles together, creating an enclosed hollow channel. The microneedle arrays developed, effectively penetrate the skin without significant indentation, thereby enabling effective delivery of active ingredients via either a poke and patch application using solid microneedles or direct injection using hollow microneedles. This simple, scalable and cost effective method utilises KOH to etch the silicon wafer in-plane, allowing microneedles with variable length of several mm to be fabricated, as opposed to out-of-plane MNs, which are geometrically restricted to dimensions less than the thickness of the wafer. These microneedle arrays have been used to demonstrate effective delivery of insulin and hyaluronic acid into the skin.
published_date 2022-02-01T04:12:37Z
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score 11.013082

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