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The Effect of Processing Variables on Powder Interlayer Bonding in Nickel-Based Superalloys

Olivia Stanners Stanners, Sean John, Helen Davies Orcid Logo, Ieuan Watkins, Silvia Marchisio

Materials, Volume: 13, Issue: 3, Start page: 601

Swansea University Authors: Olivia Stanners Stanners, Sean John, Helen Davies Orcid Logo, Ieuan Watkins

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DOI (Published version): 10.3390/ma13030601

Abstract

Powder Interlayer Bonding (PIB) has been considered as a lower-energy joining technology for nickel-based superalloys compared to conventional methods; such as friction welding. Typically; nickel-based superalloys exhibit high energy requirements for joining due to their high operating temperatures....

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Published in: Materials
ISSN: 1996-1944
Published: MDPI AG 2020
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa53410
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Abstract: Powder Interlayer Bonding (PIB) has been considered as a lower-energy joining technology for nickel-based superalloys compared to conventional methods; such as friction welding. Typically; nickel-based superalloys exhibit high energy requirements for joining due to their high operating temperatures. However; PIB utilizes a localized temperature gradient created by an induction current; reducing the energy requirements for the process. PIB is a solid-state joining method that compresses and heats a powder interlayer between two faying surfaces to produce one joined workpiece. It has been successfully used to bond titanium alloys; and the objectives of this work were to explore its application as a joining method for nickel-based superalloys. Initial results showed that joining nickel-based superalloys via PIB is possible; and bondlines with very little porosity were observed. Further analysis showed that these bonded areas had lower porosity than the base material; suggesting PIB could be a successful joining method for difficult-to-join nickel-based superalloys.
Keywords: powder; interlayer; bonding; joining; nickel-based superalloys
College: Faculty of Science and Engineering
Funders: UKRI, EP/R512382/1, EP/H022309/1
Issue: 3
Start Page: 601