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A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment

Harry Fulton, Oliver Ansell, Janet Hopkins, Martin Hanicinec, Takuo Nishida, Taku Umemoto, Lijie Li Orcid Logo

IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 10, Issue: 4, Pages: 694 - 703

Swansea University Author: Lijie Li Orcid Logo

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DOI (Published version): 10.1109/tcpmt.2020.2966724

Abstract

The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision...

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Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN: 2156-3950 2156-3985
Published: Institute of Electrical and Electronics Engineers (IEEE) 2020
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URI: https://cronfa.swan.ac.uk/Record/cronfa53280
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first_indexed 2020-01-16T13:42:19Z
last_indexed 2023-01-11T14:30:48Z
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spelling 2022-08-26T14:22:40.7015816 v2 53280 2020-01-16 A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment ed2c658b77679a28e4c1dcf95af06bd6 0000-0003-4630-7692 Lijie Li Lijie Li true false 2020-01-16 EEEG The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision of integrated circuit packaging. Die singulation has traditionally been accomplished using a diamond saw, laser-based technology, or a combination of both. The stress on dicing tape was, therefore, limited to fatigue through the physical nature of saw dicing or heat energies induced during laser dicing. These processes do not expose dicing tape to either a high vacuum or a variety of plasma chemistries. This investigative work is a continuation of studies examining the dicing tape behavior when used in plasma dicing. Results show that polyolefin (PO) UV tape with low-to-medium adhesion strength exhibits the greatest resilience under harsh plasma etch conditions and that efficient photoinitiated cross linking (or curing) of the adhesive is triggered if directly exposed to the photonic energies present in a pure SF 6 plasma or full plasma dicing process. However, the postplasma dice, post-UV cure adhesive strength can still be minimized if the tape manufacturers recommended time limitations between which the tape mount, plasma dice, and die pickup process are adhered to. Journal Article IEEE Transactions on Components, Packaging and Manufacturing Technology 10 4 694 703 Institute of Electrical and Electronics Engineers (IEEE) 2156-3950 2156-3985 dicing , plasma , singulation , UV-tape , anti-ESD 1 4 2020 2020-04-01 10.1109/tcpmt.2020.2966724 COLLEGE NANME Electronic and Electrical Engineering COLLEGE CODE EEEG Swansea University 2022-08-26T14:22:40.7015816 2020-01-16T08:01:04.1929789 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering Harry Fulton 1 Oliver Ansell 2 Janet Hopkins 3 Martin Hanicinec 4 Takuo Nishida 5 Taku Umemoto 6 Lijie Li 0000-0003-4630-7692 7 53280__16918__7d7d6505cca14327ab7dc8ff43ba3092.pdf 53280.pdf 2020-03-25T13:09:33.3765797 Output 1157034 application/pdf Accepted Manuscript true 2020-01-15T00:00:00.0000000 true eng
title A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment
spellingShingle A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment
Lijie Li
title_short A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment
title_full A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment
title_fullStr A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment
title_full_unstemmed A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment
title_sort A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment
author_id_str_mv ed2c658b77679a28e4c1dcf95af06bd6
author_id_fullname_str_mv ed2c658b77679a28e4c1dcf95af06bd6_***_Lijie Li
author Lijie Li
author2 Harry Fulton
Oliver Ansell
Janet Hopkins
Martin Hanicinec
Takuo Nishida
Taku Umemoto
Lijie Li
format Journal article
container_title IEEE Transactions on Components, Packaging and Manufacturing Technology
container_volume 10
container_issue 4
container_start_page 694
publishDate 2020
institution Swansea University
issn 2156-3950
2156-3985
doi_str_mv 10.1109/tcpmt.2020.2966724
publisher Institute of Electrical and Electronics Engineers (IEEE)
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering
document_store_str 1
active_str 0
description The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision of integrated circuit packaging. Die singulation has traditionally been accomplished using a diamond saw, laser-based technology, or a combination of both. The stress on dicing tape was, therefore, limited to fatigue through the physical nature of saw dicing or heat energies induced during laser dicing. These processes do not expose dicing tape to either a high vacuum or a variety of plasma chemistries. This investigative work is a continuation of studies examining the dicing tape behavior when used in plasma dicing. Results show that polyolefin (PO) UV tape with low-to-medium adhesion strength exhibits the greatest resilience under harsh plasma etch conditions and that efficient photoinitiated cross linking (or curing) of the adhesive is triggered if directly exposed to the photonic energies present in a pure SF 6 plasma or full plasma dicing process. However, the postplasma dice, post-UV cure adhesive strength can still be minimized if the tape manufacturers recommended time limitations between which the tape mount, plasma dice, and die pickup process are adhered to.
published_date 2020-04-01T04:06:09Z
_version_ 1763753454421934080
score 11.013776

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