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Low Reynolds number heat transfer prediction employing large eddy simulation for electronics geometrics. / James C Tyacke

Swansea University Author: James C Tyacke

Abstract

The accurate prediction of convective heat transfer within electronics systems has always been of great importance for the reliability of such systems. Current computational methods based on the Reynolds-Averaged Navier-Stokes equations do not provide reliable predictions due to the inability of cur...

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Published: 2009
Institution: Swansea University
Degree level: Doctoral
Degree name: Ph.D
URI: https://cronfa.swan.ac.uk/Record/cronfa42811
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first_indexed 2018-08-02T18:55:36Z
last_indexed 2018-08-03T10:11:09Z
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spelling 2018-08-02T16:24:30.5389960 v2 42811 2018-08-02 Low Reynolds number heat transfer prediction employing large eddy simulation for electronics geometrics. 793e2be4ddcc48a1f04c422374864b0b NULL James C Tyacke James C Tyacke true true 2018-08-02 The accurate prediction of convective heat transfer within electronics systems has always been of great importance for the reliability of such systems. Current computational methods based on the Reynolds-Averaged Navier-Stokes equations do not provide reliable predictions due to the inability of current methods to capture complex time dependent flow features. This study investigates the use of time dependent Large Eddy Simulation and hybrid methods to make more reliable thermal predictions. These methods are tested on a heated ribbed channel, a heated cube in an array of cubes and a complex CPU case. A variety of models and methodologies are applied and analysed. It is apparent that the most important scales are the large vortices generated by geometrical features. Due to the low Reynolds number flows found in electronics systems, there is a relatively small range of scales to capture. This gives rise to some unpredictability in model choice and grid resolution, though consistency is much improved over traditional methods. Important sources of error are considered to be problem definition and boundary conditions for which unsteady data is not available. Use of nonlinear models and higher order discretisation did not provide adequate improvements in accuracy for the increase in computational expense. Combining Reynolds-Averaged Navier-Stokes and Implicit Large Eddy Simulation into a hybrid model seems to provide fair reliability when compared to other modelling methods on a range of grid resolutions. E-Thesis Computer engineering.;Mechanical engineering.;Thermodynamics. 31 12 2009 2009-12-31 COLLEGE NANME Engineering COLLEGE CODE Swansea University Doctoral Ph.D 2018-08-02T16:24:30.5389960 2018-08-02T16:24:30.5389960 Faculty of Science and Engineering School of Engineering and Applied Sciences - Uncategorised James C Tyacke NULL 1 0042811-02082018162523.pdf 10807587.pdf 2018-08-02T16:25:23.7670000 Output 8331659 application/pdf E-Thesis true 2018-08-02T16:25:23.7670000 false
title Low Reynolds number heat transfer prediction employing large eddy simulation for electronics geometrics.
spellingShingle Low Reynolds number heat transfer prediction employing large eddy simulation for electronics geometrics.
James C Tyacke
title_short Low Reynolds number heat transfer prediction employing large eddy simulation for electronics geometrics.
title_full Low Reynolds number heat transfer prediction employing large eddy simulation for electronics geometrics.
title_fullStr Low Reynolds number heat transfer prediction employing large eddy simulation for electronics geometrics.
title_full_unstemmed Low Reynolds number heat transfer prediction employing large eddy simulation for electronics geometrics.
title_sort Low Reynolds number heat transfer prediction employing large eddy simulation for electronics geometrics.
author_id_str_mv 793e2be4ddcc48a1f04c422374864b0b
author_id_fullname_str_mv 793e2be4ddcc48a1f04c422374864b0b_***_James C Tyacke
author James C Tyacke
author2 James C Tyacke
format E-Thesis
publishDate 2009
institution Swansea University
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Engineering and Applied Sciences - Uncategorised{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Uncategorised
document_store_str 1
active_str 0
description The accurate prediction of convective heat transfer within electronics systems has always been of great importance for the reliability of such systems. Current computational methods based on the Reynolds-Averaged Navier-Stokes equations do not provide reliable predictions due to the inability of current methods to capture complex time dependent flow features. This study investigates the use of time dependent Large Eddy Simulation and hybrid methods to make more reliable thermal predictions. These methods are tested on a heated ribbed channel, a heated cube in an array of cubes and a complex CPU case. A variety of models and methodologies are applied and analysed. It is apparent that the most important scales are the large vortices generated by geometrical features. Due to the low Reynolds number flows found in electronics systems, there is a relatively small range of scales to capture. This gives rise to some unpredictability in model choice and grid resolution, though consistency is much improved over traditional methods. Important sources of error are considered to be problem definition and boundary conditions for which unsteady data is not available. Use of nonlinear models and higher order discretisation did not provide adequate improvements in accuracy for the increase in computational expense. Combining Reynolds-Averaged Navier-Stokes and Implicit Large Eddy Simulation into a hybrid model seems to provide fair reliability when compared to other modelling methods on a range of grid resolutions.
published_date 2009-12-31T03:53:42Z
_version_ 1763752670201380864
score 11.013731

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