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Surface-initiated growth of copper using isonicotinic acid-functionalized aluminum oxide surfaces
Journal of Coatings Technology and Research, Volume: 14, Issue: 1, Pages: 195 - 205
Swansea University Authors: Cathren Gowenlock , Virginia Gomez , James McGettrick , Enrico Andreoli , Andrew Barron
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DOI (Published version): 10.1007/s11998-016-9842-0
Abstract
Isonicotinate self-assembled monolayers (SAM) were prepared on alumina surfaces (A) using isonicotinic acid (iNA). These functionalized layers (iNA-A) were used for the seeded growth of copper films (Cu-iNA-A) by hydrazine hydrate-initiated electroless deposition. The films were characterized by sca...
Published in: | Journal of Coatings Technology and Research |
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ISSN: | 1547-0091 1935-3804 |
Published: |
2017
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Online Access: |
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URI: | https://cronfa.swan.ac.uk/Record/cronfa30991 |
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Abstract: |
Isonicotinate self-assembled monolayers (SAM) were prepared on alumina surfaces (A) using isonicotinic acid (iNA). These functionalized layers (iNA-A) were used for the seeded growth of copper films (Cu-iNA-A) by hydrazine hydrate-initiated electroless deposition. The films were characterized by scanning electron microscopy (SEM), electron-dispersive X-ray spectroscopy, atomic force microscopy, X-ray photoelectron spectroscopy, X-ray diffraction, and advancing contact angle measurements. The films are Cu0 but with surface oxidation, and show a faceted morphology, which is more textured (Rq = 460 ± 90 nm) compared to the SAM (Rq = 2.8 ± 0.5 nm). In contrast, growth of copper films by SnCl2/PdCl2 catalyzed electroless deposition, using formaldehyde (CH2O) as the reducing agent, shows a nodular morphology on top of a relatively smooth surface. No copper films are observed in the absence of the isonicotinate SAM. The binding of Cu2+ to the iNA is proposed to facilitate reduction to Cu0 and create the seed for subsequent growth. The films show good adhesion to the functionalized surface. |
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College: |
Faculty of Science and Engineering |
Issue: |
1 |
Start Page: |
195 |
End Page: |
205 |