Patent 907 views
Sensor device and method of fabricating sensor device
Swansea University Author:
Alex Lord
Abstract
[en] A method of fabricating a sensor device from a substrate comprising a plurality of transistor components (4, 6), a dielectric layer (10) isolating the transistor components, a plurality of contact electrodes (12, 14) of a first conductive material, and at least one gate electrode (24) arranged...
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa18718 |
| first_indexed |
2015-06-26T01:59:50Z |
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| last_indexed |
2024-11-14T11:18:44Z |
| id |
cronfa18718 |
| recordtype |
SURis |
| fullrecord |
<?xml version="1.0"?><rfc1807><datestamp>2023-06-02T14:47:45.5591556</datestamp><bib-version>v2</bib-version><id>18718</id><entry>2014-10-14</entry><title>Sensor device and method of fabricating sensor device</title><swanseaauthors><author><sid>d547bad707e12f5a9f12d4fcbeea87ed</sid><ORCID>0000-0002-6258-2187</ORCID><firstname>Alex</firstname><surname>Lord</surname><name>Alex Lord</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2014-10-14</date><abstract>[en] A method of fabricating a sensor device from a substrate comprising a plurality of transistor components (4, 6), a dielectric layer (10) isolating the transistor components, a plurality of contact electrodes (12, 14) of a first conductive material, and at least one gate electrode (24) arranged on the dielectric layer is disclosed. The method comprises forming a trench in the substrate to expose the gate electrode (24), forming a seed layer of a semiconductor material in the trench, forming a plurality of elongate wires (30) of the semiconductor material on and extending from the seed layer, and forming a layer (32) of a second conductive material, at ends of the elongate wires in the trench.</abstract><type>Patent / published patent application</type><journal/><volume/><journalNumber/><paginationStart/><paginationEnd/><publisher/><placeOfPublication/><isbnPrint/><isbnElectronic/><issnPrint/><issnElectronic/><keywords/><publishedDay>0</publishedDay><publishedMonth>0</publishedMonth><publishedYear>0</publishedYear><publishedDate>0001-01-01</publishedDate><doi/><url/><notes/><college>COLLEGE NANME</college><CollegeCode>COLLEGE CODE</CollegeCode><institution>Swansea University</institution><apcterm/><funders/><projectreference/><lastEdited>2023-06-02T14:47:45.5591556</lastEdited><Created>2014-10-14T16:08:57.8754983</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Engineering and Applied Sciences - Uncategorised</level></path><authors><author><firstname>Alex</firstname><surname>Lord</surname><orcid>0000-0002-6258-2187</orcid><order>1</order></author></authors><documents/><OutputDurs/></rfc1807> |
| spelling |
2023-06-02T14:47:45.5591556 v2 18718 2014-10-14 Sensor device and method of fabricating sensor device d547bad707e12f5a9f12d4fcbeea87ed 0000-0002-6258-2187 Alex Lord Alex Lord true false 2014-10-14 [en] A method of fabricating a sensor device from a substrate comprising a plurality of transistor components (4, 6), a dielectric layer (10) isolating the transistor components, a plurality of contact electrodes (12, 14) of a first conductive material, and at least one gate electrode (24) arranged on the dielectric layer is disclosed. The method comprises forming a trench in the substrate to expose the gate electrode (24), forming a seed layer of a semiconductor material in the trench, forming a plurality of elongate wires (30) of the semiconductor material on and extending from the seed layer, and forming a layer (32) of a second conductive material, at ends of the elongate wires in the trench. Patent / published patent application 0 0 0 0001-01-01 COLLEGE NANME COLLEGE CODE Swansea University 2023-06-02T14:47:45.5591556 2014-10-14T16:08:57.8754983 Faculty of Science and Engineering School of Engineering and Applied Sciences - Uncategorised Alex Lord 0000-0002-6258-2187 1 |
| title |
Sensor device and method of fabricating sensor device |
| spellingShingle |
Sensor device and method of fabricating sensor device Alex Lord |
| title_short |
Sensor device and method of fabricating sensor device |
| title_full |
Sensor device and method of fabricating sensor device |
| title_fullStr |
Sensor device and method of fabricating sensor device |
| title_full_unstemmed |
Sensor device and method of fabricating sensor device |
| title_sort |
Sensor device and method of fabricating sensor device |
| author_id_str_mv |
d547bad707e12f5a9f12d4fcbeea87ed |
| author_id_fullname_str_mv |
d547bad707e12f5a9f12d4fcbeea87ed_***_Alex Lord |
| author |
Alex Lord |
| author2 |
Alex Lord |
| format |
Patent |
| institution |
Swansea University |
| college_str |
Faculty of Science and Engineering |
| hierarchytype |
|
| hierarchy_top_id |
facultyofscienceandengineering |
| hierarchy_top_title |
Faculty of Science and Engineering |
| hierarchy_parent_id |
facultyofscienceandengineering |
| hierarchy_parent_title |
Faculty of Science and Engineering |
| department_str |
School of Engineering and Applied Sciences - Uncategorised{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Uncategorised |
| document_store_str |
0 |
| active_str |
0 |
| description |
[en] A method of fabricating a sensor device from a substrate comprising a plurality of transistor components (4, 6), a dielectric layer (10) isolating the transistor components, a plurality of contact electrodes (12, 14) of a first conductive material, and at least one gate electrode (24) arranged on the dielectric layer is disclosed. The method comprises forming a trench in the substrate to expose the gate electrode (24), forming a seed layer of a semiconductor material in the trench, forming a plurality of elongate wires (30) of the semiconductor material on and extending from the seed layer, and forming a layer (32) of a second conductive material, at ends of the elongate wires in the trench. |
| published_date |
0001-01-01T03:33:20Z |
| _version_ |
1851543624506933248 |
| score |
11.090091 |

