Burwell, G., Rejnhard, K., Evans, J., Mitchell, J., Grimes, M. T., Elwin, M., . . . Meredith, P. (2023). A Low‐Temperature Batch Process for the Deposition of High‐Quality Conformal Alumina Thin Films for Electronic Applications. Advanced Engineering Materials, 25(12), . doi:10.1002/adem.202201901
Chicago Style CitationBurwell, Gregory, Klaudia Rejnhard, Jonathan Evans, Jacob Mitchell, Michael T. Grimes, Matt Elwin, Ardalan Armin, and Paul Meredith. "A Low‐Temperature Batch Process for the Deposition of High‐Quality Conformal Alumina Thin Films for Electronic Applications." Advanced Engineering Materials 25, no. 12 (2023).
MLA CitationBurwell, Gregory, et al. "A Low‐Temperature Batch Process for the Deposition of High‐Quality Conformal Alumina Thin Films for Electronic Applications." Advanced Engineering Materials 25.12 (2023).