Li, L., Qi, Z., Shen, W., Li, R., Sun, X., Wang, Q., . . . Liang, K. (2023). AlN/diamond interface nanoengineering for reducing thermal boundary resistance by molecular dynamics simulations. Applied Surface Science, 615, p. 156419. doi:10.1016/j.apsusc.2023.156419

Li, Lijie, Zijun Qi, Wei Shen, Rui Li, Xiang Sun, Qijun Wang, Gai Wu, and Kang Liang. "AlN/diamond Interface Nanoengineering for Reducing Thermal Boundary Resistance By Molecular Dynamics Simulations." Applied Surface Science 615 (2023): 156419.

Li, Lijie, et al. "AlN/diamond Interface Nanoengineering for Reducing Thermal Boundary Resistance By Molecular Dynamics Simulations." Applied Surface Science 615 (2023): 156419.